Abstract: Provided is a method for manufacturing an Al alloy that includes Cu and C, by a manufacturing method provided with a step for adding graphite particles, and particles of a carbonization promoter containing boron or a boron compound, to Al molten metal that includes Cu.

Abstract: Provided is a method for manufacturing an Al alloy that includes Cu and C, by a manufacturing method provided with a step for adding graphite particles, and particles of a carbonization promoter containing boron or a boron compound, to Al molten metal that includes Cu.

Abstract: A copper alloy having an electrical resistivity lower than those of current copper alloys and a tensile strength higher than those of current copper alloys and a method of manufacturing such a copper alloy are provided. The copper alloy is produced by adding a predetermined amount of carbon to a molten copper in a high-temperature environment of a temperature in the range of 1200° C. to 1250° C. such that the copper alloy has a carbon content in the range of 0.01% to 0.6% by weight.

Abstract: A copper alloy having an electrical resistivity lower than those of current copper alloys and a tensile strength higher than those of current copper alloys and a method of manufacturing such a copper alloy are provided. The copper alloy is produced by adding a predetermined amount of carbon to a molten copper in a high-temperature environment of a temperature in the range of 1200° C. to 1250° C. such that the copper alloy has a carbon content in the range of 0.01% to 0.6% by weight.

Abstract: The present invention solves the problem of the bonding strength of a Pb-free alloy solder being inferior to that of the conventional Pb-containing alloy solder and provides a Pb-free alloy solder satisfactory in bonding reliability. An alloy solder is manufactured by adding a predetermined amount of carbon to a Pb-free solder in a high-temperature atmosphere of a temperature in the range of 800° C. to 1200° C. An alloy solder manufacturing method includes a melting process for melting a Pb-free solder by heating the Pb-free solder in a high-temperature atmosphere of a temperature in the range of 800° C. to 1200° C.