Abstract: A wiring board structure has an insulating base having at least one projection located thereon, wherein the insulating base and the at least one projection are integrally formed from a same piece of insulating material. The wiring board structure also has at least one lead located on the insulating base, wherein a part of the at least one lead covers the at least one projection to form at least one conductive bump.

Abstract: A multipoint conductive sheet having a plurality of conductive electrons arranged, in a multipoint fashion, on an insulative sheet such that the conductive electrons extend from a first main surface of the insulative sheet all the way to a second main surface through a thickness of the insulative sheet, each of the conductive electrons being provided at one end thereof with a first contact end which is arranged, in a multipoint fashion, on the first main surface and at the other end with a second contact end which is arranged, in a multipoint fashion, on the second main surface, wherein a slit or a slot is formed adjacent to each of the conductive electrons in such a manner as to extend through the insulative sheet, the slit or slot is allowed to extend at least two ways of each of the conductive electrons, the conductive electrons are each arranged on a sheet piece at an inner region of each of the slits or slots, and the conductive electrons can be displaced towards the first and second main surfaces while