Abstract: The present disclosure relates to systems, devices and methods for the enhanced efficiency of capturing agents of interest from a sample.

Abstract: A method for manufacturing a laminate, the method comprising a process of forming a silver-particle layer on a substrate, the process comprising allowing an aqueous solution of ammoniacal silver nitrate to contact with an aqueous solution of a reducing agent, and the aqueous solution of a reducing agent comprising a phenol compound as the reducing agent.

Abstract: A resin composition that contains: a resin that has a polar group; and an insulating filler that, on a volume-based particle size distribution curve, has a particle size of no more than 5.0 µm at an accumulation of 50% from the smaller side and a particle size of no more than 10.0 µm at an accumulation of 99% from the smaller side. The insulating filler is at least 50 volume% of the total solid content of the resin composition.

Abstract: A primer for forming a primer layer on the surface of a substrate having surface free energy of 50 mN/m or higher, the primer including a liquid crystalline epoxy compound and a curing agent.

Abstract: A conductive film includes an elongated release film and a plurality of conductive adhesive film pieces provided on the release film. Then, the plurality of adhesive film pieces are arranged in a longitudinal direction X of the release film. For this reason, the adhesive film piece can be set to an arbitrary shape. Accordingly, it is possible to attach the adhesive film piece to adhesive surfaces having various shapes and to efficiently use the adhesive film piece.

Abstract: A moisture-curable reactive hot-melt adhesive composition comprises: a urethane prepolymer having an isocyanate group, the urethane prepolymer being a reaction product of a polyol component comprising a polyester polyol, a polyether polyol and a polybutadiene polyol with an isocyanate component; and an antioxidant.

Abstract: Provided is a method for evaluating a sample, the method including using a mixture containing a sample including at least one member selected from the group consisting of cell support-derived components, a cell suspension containing cells, an evaluation sample obtained from a cell suspension, a sample containing a liquid and microcarriers for use in cell culture, and a sample containing a liquid obtained following treatment of microcarriers, together with at least one substance selected from the group consisting of an aromatic compound having at least one functional group selected from the group consisting of a hydroxyl group, an amino group, a nitro group and a carbonyl group, and a fluorescent dye.

Abstract: A resin composition for molding includes an epoxy resin, a curing agent, and an inorganic filler containing at least one selected from the group consisting of calcium titanate particles and strontium titanate particles, in which a total content of the calcium titanate particles and the strontium titanate particles is 30% by volume or more and less than 60% by volume with respect to the entire inorganic filler.

Abstract: Disclosed is a method for manufacturing a semiconductor device which includes: a semiconductor chip; a substrate and/or another semiconductor chip; and an adhesive layer interposed therebetween. This method comprises the steps of: heating and pressuring a laminate having: the semiconductor chip; the substrate; the another semiconductor chip or a semiconductor wafer; and the adhesive layer by interposing the laminate with pressing members for temporary press-bonding to thereby temporarily press-bond the substrate and the another semiconductor chip or the semiconductor wafer to the semiconductor chip; and heating and pressuring the laminate by interposing the laminate with pressing members for main press-bonding, which are separately prepared from the pressing members for temporary press-bonding, to thereby electrically connect a connection portion of the semiconductor chip and a connection portion of the substrate or the another semiconductor chip.

Abstract: An anode material for a lithium ion secondary battery including a carbon material satisfying the following (1) to (3), (6), and (7): (1) an average particle size (D50) is 22 ?m or less, (2) D90/D10 of particle sizes is 2.2 or less, (3) a linseed oil absorption amount is 50 mL/100 g or less, (6) a portion of the carbon material with a sphericity of from 0.6 to 0.8 and a particle size of from 10 ?m to 20 ?m is 5% by number or more, and (7) a portion of the carbon material with the sphericity of 0.7 or less and a particle size of 10 ?m or less is 0.3% by number or less.

Abstract: A polyamideimide resin composition containing a polyamideimide resin (A), 4-morpholine carbaldehyde (B), water (C), and a basic compound (D), wherein the change in viscosity of the composition from before storage to after storage at 60° C. for 7 days is within ?30%.

Abstract: A polishing liquid for polishing a surface to be polished containing cobalt, the polishing liquid containing abrasive grains, at least one sugar component selected from the group consisting of a sugar alcohol, a sugar alcohol derivative, and a polysaccharide, an acid component, and water, in which a pH of the polishing liquid is more than 8.0.

Abstract: The present invention provides a prepreg for a coreless substrate and a coreless substrate and a semiconductor package using the prepreg, which can satisfy heat resistance, low thermal expansion, and bonding strength with a metal circuit at a level required for the coreless substrate. Specifically, the prepreg for a coreless substrate contains a thermosetting resin composition containing (a) dicyandiamide, (b) an adduct of a tertiary phosphine and quinones, (c) an amine compound having at least two primary amino groups, and (d) a maleimide compound having at least two primary amino groups having at least two N-substituted maleimide groups. Instead of (c) the amine compound having at least two primary amino groups and (d) the maleimide compound, having at least two N-substituted maleimide groups, (X) an amino-modified polyimide resin obtained by reacting them may be used.

Abstract: A polishing liquid comprises: abrasive grains; a compound having an aromatic heterocycle; an additive (excluding the compound having an aromatic heterocycle); and water, wherein: the abrasive grains include a hydroxide of a tetravalent metal element; the aromatic heterocycle has an endocyclic nitrogen atom not bound to a hydrogen atom; and a charge of the endocyclic nitrogen atom obtained by using the Merz-Kollman method is ?0.45 or less.

Abstract: A method for manufacturing a thermoelectric conversion module of the present invention is a method for manufacturing a thermoelectric conversion module including a thermoelectric semiconductor part in which a plurality of p-type semiconductors and a plurality of n-type semiconductors are alternately arranged, and a high temperature side electrode bound to a binding surface of the p-type semiconductor and the n-type semiconductor on a high temperature heat source side and a low temperature side electrode bound to a binding surface of the p-type semiconductor and the n-type semiconductor on a low temperature heat source side, which electrically connect the p-type semiconductor and the n-type semiconductor adjacent to each other in series, and includes a binding step of binding at least one of the high temperature side electrode and the low temperature side electrode, and the p-type semiconductor and the n-type semiconductor together, by sintering a binding layer containing metal particles, which is provided bet

Abstract: A polishing liquid containing abrasive grains, a hydroxy acid, a polyol, and a liquid medium, in which a zeta potential of the abrasive grains is positive, and the hydroxy acid has one carboxyl group and one to three hydroxyl groups.

Abstract: A slurry containing abrasive grains and a liquid medium, the abrasive grains including first particles and second particles being in contact with the first particles, the first particles containing ceria, the first particles having a negative zeta potential, the second particles containing a hydroxide of a tetravalent metal element, and the second particles having a positive zeta potential.

Abstract: A foam-molded product including a foam layer, and a skin layer covering the foam layer, in which the maximum diameter of bubbles in the foam layer is 0.90 mm or less; and a method for manufacturing a foam-molded product and a method for suppressing an appearance defect of a foam-molded product, including an injection process and a foaming process, wherein the foam-molded product after molding includes a foam layer and a skin layer covering the foam layer, the skin layer having an average thickness of from 0.3 mm to 0.7 mm, and wherein expanding of the volume of the cavity includes performing a core-back process of the mold such that a thickness of the foam-molded product after molding is within ±0.2 mm of a predetermined target thickness.

Abstract: An injection molded product includes a main body portion having a design surface and an opposite surface; and a projecting portion provided at a peripheral edge portion of the main body portion, and projecting out toward a side opposite from the design surface in a thickness direction of the main body portion, wherein a thickness A of the main body portion and a thickness B of the projecting portion satisfy a relationship of A?B.

Abstract: An epoxy resin, comprising an epoxy compound A that has at least two mesogenic structures and at least one phenylene group, and an epoxy compound B that has at least two mesogenic structures and at least one divalent biphenyl group.