Patents Assigned to SHOWA DENKO MATERIALS CO., LTD.
  • Patent number: 10998546
    Abstract: A negative electrode active material for a lithium ion secondary battery, the negative electrode active material includes silicon oxide particles, each of which has carbon on at least a portion of its surface, in which: a ratio (PSi/PSiO2) of an intensity of an X-ray diffraction peak at 2? of from 27° to 29°, which is derived from Si, to an intensity of an X-ray diffraction peak at 2? of from 20° to 25°, which is derived from SiO2, is within a range of from 1.0 to 2.6, when CuK? radiation having a wavelength of 0.15406 nm is used as a radiation source; and a specific surface area calculated from moisture adsorption at 298 K is 6.5 m2/g or less.
    Type: Grant
    Filed: January 31, 2018
    Date of Patent: May 4, 2021
    Assignee: Showa Denko Materials Co., Ltd.
    Inventors: Akira Yasuda, Yoshie Ohsaki, Tatsuya Nishida
  • Publication number: 20210124267
    Abstract: A photosensitive film of the present invention includes a carrier film having a first surface whose surface roughness is 0.1 to 0.4 ?m, and a photosensitive layer formed on the first surface, in which a haze of the carrier film is 30 to 65%, and a spectral haze at a wavelength of 405 nm of the carrier film, as measured by providing a transparent resin layer in which a difference between a refractive index of the transparent resin layer and a refractive index of the photosensitive layer is within ±0.02 on the first surface, is 0.1 to 9.0%.
    Type: Application
    Filed: May 9, 2019
    Publication date: April 29, 2021
    Applicants: Showa Denko Materials Co., Ltd., KIMOTO CO., LTD.
    Inventors: Hideki ETORI, Keiko KITAMURA, Yoshiaki FUSE, Nobuhito KOMURO
  • Patent number: 10988585
    Abstract: A resin sheet includes an epoxy resin including an epoxy resin oligomer and an epoxy resin monomer; a curing agent; and an inorganic filler, wherein a content of the inorganic filler is more than 30% by volume but less than 80% by volume.
    Type: Grant
    Filed: August 25, 2016
    Date of Patent: April 27, 2021
    Assignee: Showa Denko Materials Co., Ltd.
    Inventors: Tomoo Nishiyama, Yoshitaka Takezawa, Hideyuki Katagi, Kazuya Kiguchi
  • Publication number: 20210114147
    Abstract: A method for producing an anisotropic conductive film, which includes: a preparation step wherein a base material that has a plurality of recesses and solder fine particles are prepared; an accommodation step wherein at least some of the solder fine particles are accommodated in the recesses; a fusing step wherein the solder fine particles accommodated in the recesses are fused, thereby forming solder particles within the recesses; a transfer step wherein an insulating resin material is brought into contact with the recess opening side of the base material that includes the solder particles in the recesses, thereby obtaining a first resin layer on which the solder particles have been transferred; and a layering step wherein a second resin layer that is configured from an insulating resin material is formed on the surface of the first resin layer, on which the solder particles have been transferred, thereby obtaining an anisotropic conductive film.
    Type: Application
    Filed: June 26, 2019
    Publication date: April 22, 2021
    Applicant: Showa Denko Materials Co., Ltd.
    Inventors: Kunihiko AKAI, Yoshinori EJIRI, Yuuhei OKADA, Toshimitsu MORIYA, Shinichirou SUKATA, Masayuki MIYAJI
  • Publication number: 20210114145
    Abstract: The present invention relates to solder particles, each of which partially has a flat portion in the surface. By using these solder particles, electrodes facing each other are able to be appropriately connected, thereby achieving an anisotropic conductive material that exhibits excellent conduction reliability and excellent insulation reliability.
    Type: Application
    Filed: June 26, 2019
    Publication date: April 22, 2021
    Applicant: Showa Denko Materials Co., Ltd.
    Inventors: Kunihiko AKAI, Yoshinori EJIRI, Yuuhei OKADA, Toshimitsu MORIYA, Shinichirou SUKATA, Masayuki MIYAJI
  • Patent number: 10968135
    Abstract: The lead-free glass composition contains vanadium oxide, tellurium oxide, alkali metal oxide, iron oxide, barium oxide, and tungsten oxide while containing substantially no phosphorus oxide, and further contains at least one of additional components including yttrium oxide, lanthanum oxide, cerium oxide, erbium oxide, ytterbium oxide, aluminum oxide, and gallium oxide. A content of the tellurium oxide is equal to or more than 25 mol %, and equal to or less than 43 mol % in terms of oxide TeO2. A content of the alkali metal oxide is equal to or more than 4 mol %, and equal to or less than 27 mol % in terms of oxide R2O (R: alkali metal element).
    Type: Grant
    Filed: May 29, 2019
    Date of Patent: April 6, 2021
    Assignee: Showa Denko Materials Co., Ltd.
    Inventors: Takashi Naito, Taigo Onodera, Tatsuya Miyake, Akitoyo Konno, Shinichi Tachizono, Yuji Hashiba, Keita Yuguchi, Takahiro Ikabata, Masaharu Matsuura
  • Patent number: 10968329
    Abstract: A method of recovering a decomposition product of a thermosetting resin cured product, the method includes a step of contacting an object to be treated, that contains a thermosetting resin cured product, with a treatment liquid containing an alkali metal compound and an alcohol solvent, to decompose and dissolve the thermosetting resin cured product; a step of mixing the treatment liquid, in which a decomposition product of the thermosetting resin cured product is dissolved, and an acidic aqueous solution to separate the mixture into an aqueous layer and an organic layer containing the decomposition product; and a step of recovering the organic layer.
    Type: Grant
    Filed: March 8, 2016
    Date of Patent: April 6, 2021
    Assignee: SHOWA DENKO MATERIALS CO., LTD.
    Inventors: Kanako Ishihara, Kazuhito Kobayashi
  • Patent number: 10960651
    Abstract: A laminate, comprising an intermediate layer and a covering material A and a covering material B that are disposed on respective sides of the intermediate layer, the covering material A being disposed with an orientation direction at an angle of 20° or less with respect to an orientation direction of the covering material B.
    Type: Grant
    Filed: December 28, 2017
    Date of Patent: March 30, 2021
    Assignee: SHOWA DENKO MATERIALS CO., LTD.
    Inventors: Futoshi Oikawa, Masashi Takahashi, Tomomi Kawamura
  • Patent number: 10957964
    Abstract: Provided is a multilayered transmission line plate including one pair of ground layers, a differential wiring layer disposed between one ground layer and the other ground layer of the one pair of ground layers, a first insulating portion disposed between the differential wiring layer and the one ground layer, and a second insulating portion disposed between the differential wiring layer and the other ground layer, wherein the first insulating portion has a resin layer, the first insulating portion or the second insulating portion has a fiber base material layer including a fiber base material, and a thickness of the first insulating portion is equal to or thinner than a thickness of the second insulating portion.
    Type: Grant
    Filed: July 20, 2016
    Date of Patent: March 23, 2021
    Assignee: SHOWA DENKO MATERIALS CO., LTD.
    Inventors: Takao Tanigawa, Tetsurou Irino, Yuusuke Kondou, Etsuo Mizushima, Tomio Fukuda, Yuki Nagai
  • Patent number: 10957936
    Abstract: A lithium ion secondary battery includes a positive electrode containing a spinel-type lithium-nickel-manganese composite oxide as a positive electrode active material; a negative electrode containing, as a negative electrode active material, an active material in which introduction and release of lithium ions take place at a potential of 1.2 V or higher relative to a lithium potential; a separator inserted between the positive electrode and the negative electrode; and an electrolytic solution, wherein a capacity ratio of a negative electrode capacity of the negative electrode to a positive electrode capacity of the positive electrode (negative electrode capacity/positive electrode capacity) is 1 or lower, and the electrolytic solution contains dimethyl carbonate as a non-aqueous solvent at a content ratio of higher than 70% by volume with respect to a total amount of the non-aqueous solvent.
    Type: Grant
    Filed: November 2, 2016
    Date of Patent: March 23, 2021
    Assignee: Showa Denko Materials Co., Ltd.
    Inventor: Yuma Gogyo
  • Patent number: 10947326
    Abstract: An adhesive composition comprising (a) a (meth)acrylic polymer, (b) a compound having at least two (meth)acryloyl groups, (c) a polymerization initiator and (d) a filler.
    Type: Grant
    Filed: July 27, 2016
    Date of Patent: March 16, 2021
    Assignee: SHOWA DENKO MATERIALS CO., LTD.
    Inventors: Sadaaki Katou, Takuya Komine, Shinjiro Fujii
  • Patent number: 10946494
    Abstract: A polishing agent for polishing a resin comprises abrasive grains, a water-soluble polymer having an ether bond, an organic solvent and water, wherein the abrasive grains have a positive charge in the polishing agent and an average particle diameter of the abrasive grains is larger than 20 nm.
    Type: Grant
    Filed: March 8, 2016
    Date of Patent: March 16, 2021
    Assignee: Showa Denko Materials Co., Ltd.
    Inventors: Masayuki Hanano, Masaya Nishiyama, Yutaka Goh, Haruaki Sakurai, Tomohiro Iwano
  • Patent number: 10941241
    Abstract: The present disclosure provides: an epoxy resin molding material including; an epoxy resin having a mesogen structure, a phenolic curing agent, an inorganic filler, and a curing accelerator having a quaternary phosphonium cation represented by the following Formula (I); a molded product and a molded cured product using the epoxy resin molding material; and a method for producing a molded cured product. In Formula (I), each of Ra to Rd independently represents an alkyl group having from 1 to 6 carbon atoms, or an aryl group, and the alkyl group and the aryl group may have a substituent.
    Type: Grant
    Filed: August 25, 2016
    Date of Patent: March 9, 2021
    Assignee: SHOWA DENKO MATERIALS CO., LTD.
    Inventors: Kenji Tanaka, Yuka Yoshida, Shinichi Kosugi, Shingo Tanaka, Hideyuki Katagi, Haruaki Sue, Yoshitaka Takezawa
  • Patent number: 10940674
    Abstract: The present invention provides a resin varnish, a prepreg, a laminate and a printed wiring board, using a thermosetting resin composition having high heat resistance, low relative permittivity, high metal foil adhesion, high glass transition temperature and low thermal expansion and excellent in moldability and platability. Specifically, the resin varnish contains (A) a maleimide compound, (B) an epoxy resin, (C) a copolymer resin having a structural unit derived from an aromatic vinyl compound and a structural unit derived from a maleic anhydride, (D) a silica treated with an aminosilane coupling agent, and (G) an organic solvent.
    Type: Grant
    Filed: December 7, 2016
    Date of Patent: March 9, 2021
    Assignee: SHOWA DENKO MATERIALS CO., LTD.
    Inventors: Yoshikatsu Shiraokawa, Minoru Kakitani, Hiroshi Shimizu, Keisuke Kushida, Tatsunori Kaneko
  • Patent number: 10944126
    Abstract: A positive electrode for a lithium ion secondary battery, including a positive electrode current collector, a conductive layer which is disposed directly or indirectly on the positive electrode current collector, and which includes a conductive particle, a polymer particle, and a fluororesin or a resin including a structural unit derived from a nitrile group-containing monomer, and a positive electrode active material layer disposed directly or indirectly on the conductive layer, as well as a lithium ion secondary battery using the same.
    Type: Grant
    Filed: November 30, 2015
    Date of Patent: March 9, 2021
    Assignee: Showa Denko Materials Co., Ltd.
    Inventors: Eisuke Haba, Masashi Aotani, Hiroki Kuzuoka
  • Patent number: 10933562
    Abstract: Provided are a method for producing an FRP precursor and a device for producing an FRP precursor, wherein the method and the device have a good productivity, and under a normal pressure, enable filling of a resin into a bulk gap of an aggregate as well as prevent the resin from spouting out from an edge portion thereof. The method for producing the FRP precursor is to produce the FRP precursor by melt-adhering each of a pair of thermosetting resin films 54 to each of both surfaces 40a and 40b of an aggregate 40 that is in a form of a sheet, the method comprising: an aggregate's surface heating process to heat aggregate's both surfaces, i.e.
    Type: Grant
    Filed: April 27, 2016
    Date of Patent: March 2, 2021
    Assignee: Showa Denko Materials Co., Ltd.
    Inventors: Yuji Tosaka, Yoshinori Satoh, Takeshi Saitoh
  • Patent number: 10934387
    Abstract: An epoxy resin obtained by a reaction of an epoxy resin monomer having a mesogen backbone and having two glycidyl groups in one molecule with a divalent phenol compound having, as substituents, two hydroxyl groups on one benzene ring, in which a number average molecular weight in gel permeation chromatographic measurement is from 600 to 2,500.
    Type: Grant
    Filed: December 25, 2015
    Date of Patent: March 2, 2021
    Assignee: Showa Denko Materials Co., Ltd.
    Inventors: Hideyuki Katagi, Kenji Tanaka, Yoshitaka Takezawa, Haruaki Sue, Shinichi Kosugi
  • Patent number: 10930612
    Abstract: A copper paste for pressureless bonding is a copper paste for pressureless bonding, containing: metal particles; and a dispersion medium, in which the metal particles include sub-micro copper particles having a volume average particle diameter of greater than or equal to 0.01 ?m and less than or equal to 0.8 ?m, and micro copper particles having a volume average particle diameter of greater than or equal to 2.0 ?m and less than or equal to 50 ?m, and the dispersion medium contains a solvent having a boiling point of higher than or equal to 300° C., and a content of the solvent having a boiling point of higher than or equal to 300° C. is greater than or equal to 2 mass % on the basis of a total mass of the copper paste for pressureless bonding.
    Type: Grant
    Filed: January 11, 2017
    Date of Patent: February 23, 2021
    Assignee: Showa Denko Materials Co., Ltd.
    Inventors: Hideo Nakako, Kazuhiko Kurafuchi, Yoshinori Ejiri, Dai Ishikawa, Chie Sugama, Yuki Kawana
  • Patent number: 10927442
    Abstract: A nanocrystal production method includes a light irradiation step of applying light to a surface of a metal material immersed in water to form nanocrystals on the surface. In this nanocrystal production method, the metal material contains iron, the nanocrystal contains at least one of iron oxide and iron hydroxide, and in the spectrum of the light, a wavelength at which the intensity is maximum is not less than 360 nm and less than 620 nm.
    Type: Grant
    Filed: August 25, 2017
    Date of Patent: February 23, 2021
    Assignees: Showa Denko Materials Co., Ltd., NATIONAL UNIVERSITY CORPORATION HOKKAIDO UNIVERSITY
    Inventors: Shuichiro Adachi, Masaki Kitagawa, Seiichi Watanabe, Lihua Zhang, Noriyuki Okinaka, Dai Takai
  • Patent number: 10927912
    Abstract: The present invention is concerned with a frictional material composition not containing copper as an element or having the content of copper of 0.5 mass % or less, the composition containing (A) potassium titanate; and (B) one or more selected from the group consisting of lithium potassium titanate and magnesium potassium titanate, in a total content of the component (A) and the component (B) of 10 to 35 mass %, wherein on heating a molded product of the frictional material composition to 500° C. at a temperature rise rate of 10° C./min under an air atmosphere, the mass reduction rate is 5 to 20%.
    Type: Grant
    Filed: August 21, 2018
    Date of Patent: February 23, 2021
    Assignee: SHOWA DENKO MATERIALS CO., LTD.
    Inventor: Masamichi Mitsumoto