Patents Assigned to Showa Denko Packaging Co.
  • Publication number: 20090258173
    Abstract: The production method of the present invention is characterized by comprising a temporary bonding step of temporarily bonding a first sheet (1) comprising a thermoplastic resin non-oriented film layer (4) and a thermoplastic adhesive resin layer (5) laminated on one surface of the thermoplastic resin non-oriented film layer (4) and a second sheet (2) comprising a heat resistant resin oriented film layer (6) and an aluminum foil layer (7) laminated on one surface of the heat resistant resin oriented film layer (6) by passing the first sheet (1) and the second sheet (2) between a pair of rolls (12, 13) in a state in which the thermoplastic adhesive resin layer (5) and the aluminum foil layer (7) are brought into contact with each other to press them while heating in a state in which the thermoplastic adhesive resin (5) does not melt to thereby obtain a pre-laminated sheet (3), and a complete bonding step of integrally bonding the first sheet (1) and the second sheet (2) by heating the pre-laminated sheet (3) to
    Type: Application
    Filed: April 28, 2006
    Publication date: October 15, 2009
    Applicant: Showa Denko Packaging Co.
    Inventor: Hiroshi Hata
  • Publication number: 20090130407
    Abstract: A packaging material for battery cases according to the present invention including a heat resistant resin oriented film layer 2 constituting an outer layer, a thermoplastic resin non-oriented film layer 3 constituting an inner layer, and an aluminum foil layer 4 disposed between both the film layers is characterized in that as the heat resistant resin oriented film, a heat resistant resin oriented film having a shrinkage percentage of 2 to 20% is used. With this packaging material, excellent formability can be secured without coating slip characteristics imparting components and sufficient volumetric energy density can be obtained.
    Type: Application
    Filed: April 28, 2006
    Publication date: May 21, 2009
    Applicant: Showa Denko Packaging Co.
    Inventor: Hiroshi Hata
  • Publication number: 20080090037
    Abstract: A packaging laminate of the present invention is characterized in that it has at least a sealant layer (2), the sealant layer (2) being a film which comprises a linear ethylene/?-olefin copolymer, has a density of 0.925-0.935 g/cm3, and contains no additives, and that the linear ethylene/?-olefin copolymer is either a copolymer produced with a metallocene catalyst as a polymerization catalyst or a copolymer which has been obtained by subjecting a linear ethylene/?-olefin copolymer produced with a Ziegler catalyst as a polymerization catalyst to an operation for removing ionic impurities and in which contained ionic impurities have been reduced or removed. The packaging laminate has a significantly reduced content of ionic impurities such as metal ions and has a significant seal strength and excellent slip properties.
    Type: Application
    Filed: November 9, 2005
    Publication date: April 17, 2008
    Applicant: Showa Denko Packaging Co.
    Inventor: Toru Masuda
  • Patent number: 7022391
    Abstract: The present invention provides a casing material for an electronic component which has a good adhesion with an aluminum foil and a resin layer, impermeability of steam, heat seal property, and corrosion resistance for an electrolyte. The present invention also provides a casing for an electronic component using the casing material. The present invention also provides an electronic component including the casing. The casing material comprises a heat resistant resin drawn film layer as an outer layer, a thermoplastic resin not-drawn film as an inner layer, and an aluminum foil layer provided between the layers. In particular, an acrylic polymer layer is provided between the aluminum foil layer and the not-drawn film layer.
    Type: Grant
    Filed: October 12, 2001
    Date of Patent: April 4, 2006
    Assignees: Showa Denko Packaging Co., Nippon Shokubai Co., Ltd.
    Inventors: Hideo Kawai, Katsumi Tanaka, Takahiro Aoyama, Mitsuo Nakazaki
  • Patent number: 6890664
    Abstract: An entry board for use in drilling small holes in boards: the entry board comprises a lubricant layer of a mixture of a polyethylene glycol having an average molecular weight of at least 3000 to less than 10000, a polyethylene glycol having an average molecular weight of at least 10000 and trimethylolpropane formed over at least one surface of an aluminum base board with an undercoat layer of a partially saponified product of polyvinyl acetate provided between the lubricant layer and the base board. The partially saponified polyvinyl acetate has a degree of saponified 15 to 70 mole % and has an average molecular weight of 9000 to 50000. The adhesion of the lubricant layer to the base board is excellent, and the lubricant layer prevents cracking.
    Type: Grant
    Filed: September 10, 2001
    Date of Patent: May 10, 2005
    Assignees: Ohtomo Chemical Inc., Corp., Showa Denko Packaging Co.
    Inventors: Shingo Kaburagi, Yoshikazu Uda, Susumu Takada, Hideo Kawai