Abstract: A structure of an outdoor illuminating device has a lamp housing disposed on a substrate. The light-emitting element of a light source module is disposed under the substrate. The heat sink of the light source module is interposed between the substrate and the lamp housing. A transparent mask covers the substrate from below, and is fixed to the substrate by a fastening element, thereby forming a closed chamber that prevents moisture from entering. The light-emitting element is inside the chamber, and the heat sink is outside the chamber.

Abstract: An LED heat dissipation structure including: a heat sink, with a lug axially extended from an end of the heat sink, a hollow portion disposed inside the heat sink and axially extended to the lug, and a plurality of fins integrally extended from a peripheral side of the heat sink; and a support base, having an axial through hole sheathed on the lug of the heat sink, and an end of the support base abutting the support surface of the heat sink. A semiconductor light emitting module is tightly coupled onto a distal surface at an end of the lug for conducting generated heat to the heat sink, and a mirror mount is pressed against the semiconductor light emitting module and coupled to the support base.

Abstract: A structure of an outdoor illuminating device has a lamp housing disposed on a substrate. The light-emitting element of a light source module is disposed under the substrate. The heat sink of the light source module is interposed between the substrate and the lamp housing. A transparent mask covers the substrate from below, and is fixed to the substrate by a fastening element, thereby forming a closed chamber that prevents moisture from entering. The light-emitting element is inside the chamber, and the heat sink is outside the chamber.

Abstract: A structure of indoor illuminating device has a substrate in a lamp housing. The light-emitting element of the light source module is disposed under the substrate. The heat sink of the light source module is located between the substrate and the lamp housing. A transparent mask covers the opening of the lamp housing under the substrate. A reflecting mask is disposed between the substrate and the transparent mask.

Abstract: An LED heat dissipation structure including: a heat sink, with a lug axially extended from an end of the heat sink, a hollow portion disposed inside the heat sink and axially extended to the lug, and a plurality of fins integrally extended from a peripheral side of the heat sink; and a support base, having an axial through hole sheathed on the lug of the heat sink, and an end of the support base abutting the support surface of the heat sink. A semiconductor light emitting module is tightly coupled onto a distal surface at an end of the lug for conducting generated heat to the heat sink, and a mirror mount is pressed against the semiconductor light emitting module and coupled to the support base.