Patents Assigned to SI FLEX CO., LTD.
  • Patent number: 11523507
    Abstract: Various embodiments disclosed in the disclosure relate to a flexible connection member and an electronic device comprising same, the flexible connection member having an RF line for signal transmission formed therein, wherein an impedance of the RF line is prevented from being changed even when a flexible printed circuit board is bent.
    Type: Grant
    Filed: August 9, 2019
    Date of Patent: December 6, 2022
    Assignees: Samsung Electronics Co., Ltd., SI FLEX CO., LTD.
    Inventors: Sungwon Park, Junghyub Kim, Hwanyoul Jeong, Seungyup Lee, Youngsun Lee, Hesuk Jung, Eunseok Hong