Abstract: An exemplary embodiment of the present invention relates to an optical assembly comprising a laser module having a pluggable interface, an optical input-output module having a pluggable interface, and a base module having a first pluggable interface that is pluggably connected to the pluggable interface of the laser module, a second pluggable interface that is pluggably connected to the pluggable interface of the input-output module, and a transceiver optically located between the first and second pluggable interface of the base module.

Abstract: The invention relates to a switch system comprising one or more optical transceiver assemblies (14) connected to a switch ASIC (29).

Abstract: An exemplary embodiment of the invention relates to a radar system comprising a radar transmission unit, a radar reception unit, and a central unit which is connected to the radar transmission unit and the radar reception unit via optical fibers. Further exemplary embodiments of the invention relate to vehicles having radar systems as well as methods for generating radar information.

Abstract: A photonic component having a photonically integrated chip and a fibre mounting, wherein the fibre mounting has: at least one groove, into which an optical fibre is placed, and at least one mirror surface, which reflects radiation from the fibre in the direction of the photonically integrated chip and/or reflects radiation from the photonically integrated chip in the direction of the fibre. A chip stack comprising at least two chips is arranged between the photonically integrated chip and the fibre mounting, the chip stack has at least two through holes and in each case a guide pin, which positions the chip stack and the fibre mounting relative to one another, passes through the at least two through holes of the chip stack.

Abstract: The invention relates to a photonic component (1) having at least one semiconductor laser amplifier (200), which has at least one first mirror surface (210a) for coupling and/or decoupling optical radiation (S). The first mirror surface (210a) of the semiconductor laser amplifier (200) is coupled to a photonically integrated chip (100), wherein the chip (100) is arranged such that the chip can emit optical radiation (S) from the chip top side (O100) thereof in the direction of the first mirror surface (210a) and couple said radiation in the semiconductor laser amplifier (200), and wherein the emitting of the radiation (S) away from the chip top side (O100) occurs in the direction of the first mirror surface (210a) at an angle of 90°±20°, in particular perpendicular, to the chip top side (O100).

Abstract: The invention relates to a circuit containing a transimpedance amplifier for converting two input currents into two output voltages, having a first amplifier part containing a first input, to which a first input voltage is applied, and into which a first input current flows, and having a second amplifier part containing a second input, to which a second input voltage is applied and into which a second input current flows, wherein the first amplifier part and the second amplifier part are connected to a common supply voltage, the first amplifier part and the second amplifier part are connected to a common current source, the input of the first amplifier part and the input of the second amplifier part have a differing direct voltage, and the first amplifier part and the second amplifier part are designed such that an output voltage of the first amplifier part is proportional to the input current of the first amplifier part and an output voltage of the second amplifier part is proportional to an input current of

Abstract: A photonic component having a photonically integrated chip and a fibre mounting, wherein the fibre mounting has: at least one groove, into which an optical fibre is placed, and at least one mirror surface, which reflects radiation from the fibre in the direction of the photonically integrated chip and/or reflects radiation from the photonically integrated chip in the direction of the fibre. A chip stack comprising at least two chips is arranged between the photonically integrated chip and the fibre mounting, the chip stack has at least two through holes and in each case a guide pin, which positions the chip stack and the fibre mounting relative to one another, passes through the at least two through holes of the chip stack.

Abstract: The invention relates to a radar antenna arrangement (1) for a vehicle (2), comprising at least one vehicle component (3), wherein the radar antenna arrangement (1) comprises a plurality of radar devices (4) which are configured to transmit and/or receive a radar beam (12). The radar devices (4) are arranged on a component surface (5) of the vehicle component (3). The invention provides for the radar antenna arrangement (1) to comprise at least one antenna row (6) for determining an azimuthal angle (10) of the radar beam (12), said antenna row comprising a plurality of the radar devices (4). Directly adjacent radar devices (4) have respective horizontal distances (8) from one another. The radar antenna arrangement (1) comprises at least one antenna column (7) for determining an elevation angle (11) of the radar beam (12), said antenna column comprising a plurality of the radar devices (4). Directly adjacent radar devices (4) have respective vertical distances (9) from one another.

Abstract: The invention relates to a switch system comprising one or more optical transceiver assemblies (14) connected to a switch ASIC (29).

Abstract: An optoelectronic device that includes at least one adjustable optical damping member arranged upstream of a photodetector and damps the optical radiation passing to the photodetector. The device is configured so that an electrical output of an amplifier is connected directly or indirectly to the adjustable optical damping member. An output signal of the amplifier or a control signal formed therewith drives the optical damping member, and the photodetector, the amplifier and the damping member are integrated in the same semiconductor substrate.

Abstract: An exemplary embodiment of the invention relates to an electrical amplifier comprising a differential preamplifier having a first output port and a second output port; and a downstream amplifier stage having a first output unit and a second output unit; wherein the first output unit is connected to the first output port of the differential preamplifier and the second output unit is connected to the second output port of the differential preamplifier; and wherein a negative impedance converter is electrically located in at least one of said differential preamplifier and said downstream amplifier stage.

Abstract: The invention relates, inter alia, to a photonic component (10), which has an interference device (20), which has at least one input and at least a first and a second output.

Abstract: An exemplary embodiment of the invention relates to an electrical amplifier comprising a differential preamplifier having a first output port and a second output port; and a downstream amplifier stage having a first output unit and a second output unit; wherein the first output unit is connected to the first output port of the differential preamplifier and the second output unit is connected to the second output port of the differential preamplifier; and wherein a negative impedance converter is electrically located in at least one of said differential preamplifier and said downstream amplifier stage.

Abstract: An exemplary embodiment of the invention relates to an optical connector comprising a wave-guiding element and a lens device configured to transmit radiation between the wave-guiding element and at least one optical port of the connector, wherein the lens device comprises a first outer surface and a second outer surface opposite the first outer surface, wherein the first outer surface is connected to the wave-guiding element and forms at least one lens, and wherein a section of the second outer surface opposite said at least one lens forms said at least one optical port of the connector.

Abstract: The invention relates to a photonic component (10) having a photonically integrated chip (1) and a fibre mounting (5), wherein the fibre mounting (5) has: at least one groove (52), into which an optical fibre (30) is placed, and at least one mirror surface (52), which reflects radiation (S) from the fibre (30) in the direction of the photonically integrated chip (1). According to the invention a chip stack (20) comprising at least two chips is arranged between the photonically integrated chip (1) and the fibre mounting (5), the chip stack (20) has at least two through holes (21) and in each case a guide pin (40), which positions the chip stack (20) and the fibre mounting (5) relative to one another, passes through the at least two through holes (21) of the chip stack (20).

Abstract: The invention relates to optical devices comprising polarization diversity couplers. An embodiment of the invention relates to an optical device comprising a polarization diversity coupler configured to receive a beam of optical radiation. The optical device may further comprise a phase shifter, a 2×N coupler, a photodetector and a control unit configured to generate a control signal based on a monitor signal of the photodetector.

Abstract: The invention relates to a component (10) with a photodetector (PD) and an electrical amplifier (TIA) connected to the photodetector (PD), wherein the photodetector (PD) and the amplifier (TIA) are integrated in the same semiconductor substrate (11). According to the invention, at least one adjustable optical damping member (30) is arranged in front of the photodetector (PD), which damping member damps or at least can damp optical radiation arriving at the photodetector (PD), an electrical output (A) of the amplifier (TIA) is connected directly or indirectly to the adjustable optical damping member (30) and an output signal (AS) of the amplifier (TIA) or a control signal (ST) formed therewith controls the optical damping member (30), and the photodetector (PD), the amplifier (TIA) and the damping member (30) are integrated in the same semiconductor substrate (11).

Abstract: The invention relates, inter alia, to a photonic component (10), which has an interference device (20), which has at least one input and at least a first and a second output.

Abstract: An exemplary embodiment of the invention relates to an optical connector comprising a wave-guiding element and a lens device configured to transmit radiation between the wave-guiding element and at least one optical port of the connector, wherein the lens device comprises a first outer surface and a second outer surface opposite the first outer surface, wherein the first outer surface is connected to the wave-guiding element and forms at least one lens, and wherein a section of the second outer surface opposite said at least one lens forms said at least one optical port of the connector.

Abstract: The invention relates to a photonic component (10) having a photonically integrated chip (1) and a fibre mounting (5), wherein the fibre mounting (5) has: at least one groove (52), into which an optical fibre (30) is placed, and at least one mirror surface (52), which reflects radiation (S) from the fibre (30) in the direction of the photonically integrated chip (1). According to the invention a chip stack (20) comprising at least two chips is arranged between the photonically integrated chip (1) and the fibre mounting (5), the chip stack (20) has at least two through holes (21) and in each case a guide pin (40), which positions the chip stack (20) and the fibre mounting (5) relative to one another, passes through the at least two through holes (21) of the chip stack (20).