Patents Assigned to Sicoya GmbH
  • Patent number: 11159131
    Abstract: An optoelectronic device that includes at least one adjustable optical damping member arranged upstream of a photodetector and damps the optical radiation passing to the photodetector. The device is configured so that an electrical output of an amplifier is connected directly or indirectly to the adjustable optical damping member. An output signal of the amplifier or a control signal formed therewith drives the optical damping member, and the photodetector, the amplifier and the damping member are integrated in the same semiconductor substrate.
    Type: Grant
    Filed: June 13, 2018
    Date of Patent: October 26, 2021
    Assignee: SICOYA GMBH
    Inventors: Ulrich Keil, Stefan Meister, Marco Vitali, Lei Yan, Chenhui Jiang, Aws Al-Saadi, Hanjo Rhee
  • Patent number: 11139787
    Abstract: An exemplary embodiment of the invention relates to an electrical amplifier comprising a differential preamplifier having a first output port and a second output port; and a downstream amplifier stage having a first output unit and a second output unit; wherein the first output unit is connected to the first output port of the differential preamplifier and the second output unit is connected to the second output port of the differential preamplifier; and wherein a negative impedance converter is electrically located in at least one of said differential preamplifier and said downstream amplifier stage.
    Type: Grant
    Filed: December 12, 2019
    Date of Patent: October 5, 2021
    Assignee: SICOYA GMBH
    Inventor: Danilo Bronzi
  • Patent number: 11119279
    Abstract: The invention relates, inter alia, to a photonic component (10), which has an interference device (20), which has at least one input and at least a first and a second output.
    Type: Grant
    Filed: November 6, 2017
    Date of Patent: September 14, 2021
    Assignee: SICOYA GMBH
    Inventors: Marco Vitali, Danilo Bronzi
  • Publication number: 20210184639
    Abstract: An exemplary embodiment of the invention relates to an electrical amplifier comprising a differential preamplifier having a first output port and a second output port; and a downstream amplifier stage having a first output unit and a second output unit; wherein the first output unit is connected to the first output port of the differential preamplifier and the second output unit is connected to the second output port of the differential preamplifier; and wherein a negative impedance converter is electrically located in at least one of said differential preamplifier and said downstream amplifier stage.
    Type: Application
    Filed: December 12, 2019
    Publication date: June 17, 2021
    Applicant: Sicoya GmbH
    Inventor: Danilo BRONZI
  • Patent number: 11002924
    Abstract: An exemplary embodiment of the invention relates to an optical connector comprising a wave-guiding element and a lens device configured to transmit radiation between the wave-guiding element and at least one optical port of the connector, wherein the lens device comprises a first outer surface and a second outer surface opposite the first outer surface, wherein the first outer surface is connected to the wave-guiding element and forms at least one lens, and wherein a section of the second outer surface opposite said at least one lens forms said at least one optical port of the connector.
    Type: Grant
    Filed: December 11, 2018
    Date of Patent: May 11, 2021
    Assignee: SICOYA GMBH
    Inventors: Moritz Grehn, Marco Vitali, Sebastian Höll, Andreas Hakansson
  • Patent number: 10948666
    Abstract: The invention relates to a photonic component (10) having a photonically integrated chip (1) and a fibre mounting (5), wherein the fibre mounting (5) has: at least one groove (52), into which an optical fibre (30) is placed, and at least one mirror surface (52), which reflects radiation (S) from the fibre (30) in the direction of the photonically integrated chip (1). According to the invention a chip stack (20) comprising at least two chips is arranged between the photonically integrated chip (1) and the fibre mounting (5), the chip stack (20) has at least two through holes (21) and in each case a guide pin (40), which positions the chip stack (20) and the fibre mounting (5) relative to one another, passes through the at least two through holes (21) of the chip stack (20).
    Type: Grant
    Filed: May 2, 2018
    Date of Patent: March 16, 2021
    Assignee: SICOYA GMBH
    Inventors: Stefan Meister, Moritz Grehn, Sven Otte, Sebastian Höll
  • Patent number: 10761352
    Abstract: The invention relates to optical devices comprising polarization diversity couplers. An embodiment of the invention relates to an optical device comprising a polarization diversity coupler configured to receive a beam of optical radiation. The optical device may further comprise a phase shifter, a 2×N coupler, a photodetector and a control unit configured to generate a control signal based on a monitor signal of the photodetector.
    Type: Grant
    Filed: September 11, 2019
    Date of Patent: September 1, 2020
    Assignee: SICOYA GMBH
    Inventors: Moritz Grehn, Thorsten Kettler, Gan Zhou, Marco Vitali
  • Publication number: 20200209482
    Abstract: The invention relates, inter alia, to a photonic component (10), which has an interference device (20), which has at least one input and at least a first and a second output.
    Type: Application
    Filed: November 6, 2017
    Publication date: July 2, 2020
    Applicant: Sicoya GmbH
    Inventors: Marco VITALI, Danilo BRONZI
  • Publication number: 20200212853
    Abstract: The invention relates to a component (10) with a photodetector (PD) and an electrical amplifier (TIA) connected to the photodetector (PD), wherein the photodetector (PD) and the amplifier (TIA) are integrated in the same semiconductor substrate (11). According to the invention, at least one adjustable optical damping member (30) is arranged in front of the photodetector (PD), which damping member damps or at least can damp optical radiation arriving at the photodetector (PD), an electrical output (A) of the amplifier (TIA) is connected directly or indirectly to the adjustable optical damping member (30) and an output signal (AS) of the amplifier (TIA) or a control signal (ST) formed therewith controls the optical damping member (30), and the photodetector (PD), the amplifier (TIA) and the damping member (30) are integrated in the same semiconductor substrate (11).
    Type: Application
    Filed: June 13, 2018
    Publication date: July 2, 2020
    Applicant: Sicoya GmbH
    Inventors: Ulrich KEIL, Stefan MEISTER, Marco VITALI, Lei YAN, Chenhui JIANG, Aws AL-SAADI, Hanjo RHEE
  • Publication number: 20200183099
    Abstract: An exemplary embodiment of the invention relates to an optical connector comprising a wave-guiding element and a lens device configured to transmit radiation between the wave-guiding element and at least one optical port of the connector, wherein the lens device comprises a first outer surface and a second outer surface opposite the first outer surface, wherein the first outer surface is connected to the wave-guiding element and forms at least one lens, and wherein a section of the second outer surface opposite said at least one lens forms said at least one optical port of the connector.
    Type: Application
    Filed: December 11, 2018
    Publication date: June 11, 2020
    Applicant: Sicoya GmbH
    Inventors: Moritz GREHN, Marco VITALI, Sebastian HÖLL, Andreas HAKANSSON
  • Publication number: 20200096713
    Abstract: The invention relates to a photonic component (10) having a photonically integrated chip (1) and a fibre mounting (5), wherein the fibre mounting (5) has: at least one groove (52), into which an optical fibre (30) is placed, and at least one mirror surface (52), which reflects radiation (S) from the fibre (30) in the direction of the photonically integrated chip (1). According to the invention a chip stack (20) comprising at least two chips is arranged between the photonically integrated chip (1) and the fibre mounting (5), the chip stack (20) has at least two through holes (21) and in each case a guide pin (40), which positions the chip stack (20) and the fibre mounting (5) relative to one another, passes through the at least two through holes (21) of the chip stack (20).
    Type: Application
    Filed: May 2, 2018
    Publication date: March 26, 2020
    Applicant: Sicoya GmbH
    Inventors: Stefan MEISTER, Moritz GREHN, Sven OTTE, Sebastian HÖLL
  • Patent number: 10591754
    Abstract: An exemplary embodiment of the present invention relates to an electro-optic modulator for modulating optical radiation. The electro-optic modulator comprises at least one upstream modulation subunit, at least one downstream modulation subunit and at least one phase-matching unit. The upstream and downstream modulation subunits are optically connected in series such that the optical radiation passes the downstream modulation subunit after passing the upstream modulation subunit. An electrical upstream modulation signal may be applied to the upstream modulation subunit, and an electrical downstream modulation signal may be applied to the downstream modulation subunit. The phase-matching unit is configured to delay the downstream modulation signal such that a phase difference between the upstream modulation signal and the downstream modulation signal is minimal.
    Type: Grant
    Filed: March 27, 2019
    Date of Patent: March 17, 2020
    Assignee: SICOYA GMBH
    Inventors: Danilo Bronzi, Ahmet Mert Özdemir
  • Patent number: 10564450
    Abstract: An exemplary embodiment of the present invention relates to an electrical amplifier comprising a differential preamplifier having a first output port and a second output port; a first output unit connected to the first output port of the differential preamplifier and a second output unit connected to the second output port of the differential preamplifier, the first and second output units being electrically arranged in parallel relative to each other; and a positive feedback loop that couples the first and second output units and comprises a first capacitor and a second capacitor; wherein each of the first and second output units comprises an emitter-follower unit and a bias transistor that is connected in series with the emitter-follower unit of its output unit; wherein an emitter of the emitter-follower unit of the first output unit is connected to a base of the bias transistor of the second output unit through the first capacitor of the positive feedback loop; and wherein an emitter of the emitter-followe
    Type: Grant
    Filed: January 11, 2019
    Date of Patent: February 18, 2020
    Assignee: SICOYA GMBH
    Inventor: Danilo Bronzi
  • Patent number: 10514584
    Abstract: An embodiment of the invention relates to an optical signal generator comprising an optical emitter configured to generate a beam of optical radiation, a first and second beam deflecting element, a modulator being located between the beam deflecting elements, a phase shifter located between the beam deflecting elements, a control unit configured to control the phase-shift of the phase shifter, wherein the first and second beam deflecting elements, the phase shifter and the modulator are located in the same plane, wherein the beam generated by the optical emitter is angled relative to said plane, wherein said first beam deflecting element is configured to deflect the emitter's beam into the plane towards the modulator, said modulator being configured to modulate the emitter's radiation and outputting a modulated radiation, wherein said second beam deflecting element is configured to deflect the modulated radiation off the plane towards an output port of the signal generator, wherein the modulator is configured
    Type: Grant
    Filed: August 10, 2017
    Date of Patent: December 24, 2019
    Assignee: Sicoya GmbH
    Inventors: Thorsten Kettler, Stefan Meister, Sven Otte
  • Patent number: 10488595
    Abstract: A photonic component that includes a photonically integrated chip and a fiber holder that is mechanically connected to said chip. The fiber holder includes at least one groove with an optical fiber laid therein. The chip includes a substrate whose substrate base material is a semiconductor material, an integrated optical waveguide that is integrated into one or more material layers of the chip, which layers are wave guiding and positioned on the substrate, a coupler formed in the optical waveguide or connected to said optical waveguide, particularly a grating coupler, and an optical diffraction and refraction structure that is integrated into one or more material layers of the chip which are positioned above the optical coupler when viewed from the substrate, and that shapes the beam prior to its being coupled into the waveguide or after being coupled out of the waveguide.
    Type: Grant
    Filed: July 28, 2017
    Date of Patent: November 26, 2019
    Assignee: Sicoya GmbH
    Inventors: Moritz Grehn, Sven Otte, Christoph Theiss, Stefan Meister, David Selicke, Hanjo Rhee
  • Patent number: 10481350
    Abstract: An embodiment of the invention relates to an optical assembly comprising a circuit board comprising a first side, a second side, and at least one hole that extends through the circuit board, a photonic chip having a front side and a back side, the front side of the photonic chip being mounted on the first side of the circuit board and electrically connected to at least one electrical conductor of the circuit board, at least one component being mounted on the front side of the photonic chip opposite the hole and protruding from the front side of the photonic chip into the hole or through the hole, and a wave-guiding element that is located on the second side of the circuit board and optically coupled to the photonic chip through said hole.
    Type: Grant
    Filed: December 11, 2018
    Date of Patent: November 19, 2019
    Assignee: Sicoya GmbH
    Inventors: Moritz Grehn, Marco Vitali, Sebastian Höll, Andreas Hakansson, Chenhui Jiang
  • Patent number: 10481355
    Abstract: An embodiment of the invention relates to an optical assembly comprising an optical emitter configured to generate a beam of optical radiation, a cap unit holding the optical emitter, a photonic chip comprising a coupler, and an intermediate chip arranged between the cap unit and the photonic chip, wherein the cap unit comprises a recess having a bottom section and a sidewall, wherein the optical emitter is mounted on the bottom section of the recess, wherein a section of the sidewall forms a mirror section angled with respect to the bottom section and configured to reflect said beam of optical radiation towards the coupler, and wherein the intermediate chip comprises a lens formed at a lens section of the intermediate chip's surface that faces the cap unit, said lens being configured to focus the reflected optical beam towards the coupler.
    Type: Grant
    Filed: April 20, 2018
    Date of Patent: November 19, 2019
    Assignee: Sicoya GmbH
    Inventors: Thorsten Kettler, Moritz Grehn, Christoph Theiss, Stefan Meister
  • Patent number: 10476600
    Abstract: An optical signal modulator comprising a modulator unit, a photodetector and an electrical signal combiner. The modular unit having an optical ingress port for optical radiation, a first and second optical output port each for modulated optical radiation, and an electrical ingress port for an electrical modulation signal. The optical radiation is modulated in response to the electrical modulation signal. The photodetector is connected to the second optical output port and configured to measure the modulated optical radiation that is emitted, and to provide a monitor signal. The electrical signal combiner having a first input port for an external electrical data signal, a second electrical input port for a correction signal based on the monitor signal, and an electrical output port that is connected to the electrical ingress port. The combiner generates the electrical modulation signal by combining the external electrical data signal and the correction signal.
    Type: Grant
    Filed: January 12, 2018
    Date of Patent: November 12, 2019
    Assignee: SICOYA GMBH
    Inventor: Ulrich Keil
  • Publication number: 20190324222
    Abstract: An embodiment of the invention relates to an optical assembly comprising an optical emitter configured to generate a beam of optical radiation, a cap unit holding the optical emitter, a photonic chip comprising a coupler, and an intermediate chip arranged between the cap unit and the photonic chip, wherein the cap unit comprises a recess having a bottom section and a sidewall, wherein the optical emitter is mounted on the bottom section of the recess, wherein a section of the sidewall forms a mirror section angled with respect to the bottom section and configured to reflect said beam of optical radiation towards the coupler, and wherein the intermediate chip comprises a lens formed at a lens section of the intermediate chip's surface that faces the cap unit, said lens being configured to focus the reflected optical beam towards the coupler.
    Type: Application
    Filed: April 20, 2018
    Publication date: October 24, 2019
    Applicant: Sicoya GmbH
    Inventors: Thorsten KETTLER, Moritz GREHN, Christoph THEISS, Stefan MEISTER
  • Publication number: 20190222319
    Abstract: An optical signal modulator comprising a modulator unit, a photodetector and an electrical signal combiner. The modular unit having an optical ingress port for optical radiation, a first and second optical output port each for modulated optical radiation, and an electrical ingress port for an electrical modulation signal. The optical radiation is modulated in response to the electrical modulation signal. The photodetector is connected to the second optical output port and configured to measure the modulated optical radiation that is emitted, and to provide a monitor signal. The electrical signal combiner having a first input port for an external electrical data signal, a second electrical input port for a correction signal based on the monitor signal, and an electrical output port that is connected to the electrical ingress port. The combiner generates the electrical modulation signal by combining the external electrical data signal and the correction signal.
    Type: Application
    Filed: January 12, 2018
    Publication date: July 18, 2019
    Applicant: Sicoya GmbH
    Inventor: Ulrich KEIL