Patents Assigned to SIEMENS AKTIENGESELLSCHAFT SIEMENS AG
  • Thermally Conductive Material for Electronic and/or Electrical Components, and Use Thereof
    Publication number: 20080027155
    Abstract: A thermally conductive and electrically insulating material, especially a paste, for mounting electrical and/or electronic components in housings and/or on cooling elements. The material is free of silicons and has a high filling ratio with moderate viscosity.
    Type: Application
    Filed: March 9, 2005
    Publication date: January 31, 2008
    Applicant: SIEMENS AKTIENGESELLSCHAFT SIEMENS AG
    Inventors: Heiner Bayer, Michael Decker, Dieter Heinl