Abstract: A double well CMOS process wherein the wells are separated by insulating trenches introduced into a semiconductor substrate, the position of the insulating trench along the isotropic under-etching in a silicon oxide layer employed together with a silicon nitride layer used as a masking layer in the implantation of the well which is first implanted. The trench itself is produced by anisotropic etching with silicon oxide masks used in the well implantations as etching masks. The trench width is defined with the isotropic etching and the trench depth is defined by the anisotropic etching. In this method, both well implantations and the trench etching are carried out with only one photo-technique. The implantation of the second well and the trench etching are self-adjusting. As a result, minimum spacings between the active zones are provided, and a space saving design is possible. The method is used in LSI CMOS processes.

Abstract: The present invention provides an improved electroplating apparatus having an electroplating cell equipped with an anode, cathode and diaphragm ring. The electroplating cell is suspended in an electrolytic bath. The cell is composed of a plastic tube whose lower opening is covered by an anode surface and whose upper opening is covered by a wafer holder for holding the semiconductor wafer. The electroplating apparatus further includes an activated carbon filtering aimed at the levelling effect.

Abstract: A receiver module for light waveguide transmission is mounted in a module housing with high precision without risk of contamination to optical surfaces by a film circuit including an intergrated circuit and an amplifier element being is pressed together against the housing floor by z-shaped retaining angles. The retaining angles are welded to metallized edge strips of the substrate before the introduction of the electro-optical components and are joined to the housing floor by laser welding.

Abstract: A transducer which has an astigmatic directional characteristic which depends on its assymetrical stiffness or, respectively, speed of sound of the material of a resonant membrane (2) which is composed of a composite fiber material.

Abstract: An electrical machine driven by a pulse-controlled a.c. converter contains multiple phases subdivided into a number of n.gtoreq.2 equivalent phases sections that are extensively magnetically decoupled relative to each other. Each phase section is fed by a separate frequency converter. The clocking of the frequency converters for the n phase sections ensues out of phase by an angle of 2.pi./n relative to each other phase section.

Abstract: A method for manufacturing melt materials of copper, chromium, and at least one readily evaporable component as well as a fusible electrode for using this method is disclosed.More specifically, an arc melting method is used for the manufacture of melt materials based on copper and chromium in which the electrode material melting off a fusible electrode of given resultant composition is collected in a water-cooled permanent mold for the purpose of cooling down without macroscopic separation of copper and chromium.A fusible electrode for use in this method is also provided. This fusible electrode partially consists of a solid alloy of copper with the readily evaporable component.

Abstract: An ultrasound sensor is used for measuring the sound pressure amplitude in the focal range of focused ultrasound shock waves. The sensor contains a polymer foil which is piezoelectrically activated in one region and is coupled to electrodes which are physically separated from the region. The polymer foil is arranged in a hollow plastic cylinder with its flat surface sides parallel to the central longitudinal axis of the hollow cylinder. By this measure, interfering diffraction effects are reduced and miniaturization of the ultrasound sensor is achieved.

Abstract: To check the presence of operating vacuum in vacuum switches, high voltage can be applied between the contacts at a given contact spacing and the dielectric strength can be tested. According to the invention, the procedure for vacuum monitoring is that a contact spacing (h) below the nominal stroke of the vacuum switch is selected and that the X-radiation generated at this contact spacing (h) and high voltage (U) in vacuum due to the field electron emission between the contacts by the contact surfaces acting as anode is acquired and evaluated as proof of the presence of operating vacuum inside the switching tube. This method can preferably be applied to encapsulated vacuum switching tubes, in particular to SF.sub.6 -insulated switching facilities.

Abstract: A circuit configuration includes a differential operational amplifier having differential input terminals and differential output terminals. A common mode feedback circuit sets a direct voltage operating point of the output terminals. A reference voltage terminal connected to the output terminals supplies a reference voltage. Two pairs of operating point transistors of complementary conductivity types have control terminals and have output circuits connected in series at a respective connection point for each pair. Each of the connection points is connected to a respective one of the output terminals. A reference current source controls the operating point transistors in parallel. First coupling capacitors are each connected between a respective one of the output terminals and a respective one of the control terminals of an associated operating point transistor of one conductivity type. The common mode feedback circuit includes second coupling capacitors and a remainder of the common mode feedback circuit.

Abstract: A method for separating laser diodes. The diodes are monolithically produced from a semiconductor substrate wafer which through an epitaxy process has been provided with a layer sequence suitable for laser operation. First, the semiconductor substrate wafer is covered with a first mask which defines the interspaces between the mirrors of adjacent laser diodes. Then the mirror surfaces are etched out of the semiconductor substrate wafer. Thereafter, the wafer is covered with a second mask for defining separation trench areas between the mirror surfaces of adjacent laser diodes and for protecting the remaining wafer parts. Then, separation are etched into the trench area. Finally, the laser diodes are separated by breaking the wafer along the trenches. In a preferred embodiment, the wafer thickness is at most twice the distance between the mirror surfaces of adjacent laser diodes and the trench depth is at least one fourth of the wafer thickness.

Abstract: A circuit for subscriber line interface circuits in a digital time-division multiplex communication switching center is disclosed. In the case of reception of the same information on the same time slot allocation via a number of subscriber line interface circuits, a transmit time slot as well as a receive time slot is alloted, but access of the transmit driver stages of the subscriber line interface circuits to the bus conductors leading to the switching center is prevented in order to avoid damaging interacting final stages in the transmit driver stages of the subscriber line interface circuits.

Abstract: Line trunk groups coupled to a double central switching matrix by way of two PCM lines and including sub-switching matrix and group control units are allocated to one another in pairs. Prepared for stand-by service switch-over by the central switching matrix and the processor are subscriber and trunk lines within each line trunk group pair, which are connected to the sub-switching matrix of a first line trunk group and are switchable to that of a second line trunk group, such that their group control unit also assumes the control functions. The processor going into service with the stand-by switch-over is connected with the group control units of all first line trunk groups via its central switching matrix, while all switching service continues with those of all second line trunk groups. Connection data of all existing connections are stored in all group control units.

Abstract: A pressure sintering method and apparatus provides that surfaces to be joined are pressed together with a pressure of at least 900 N/cm.sup.2 at a sintering temperature upon the interposition of a metal powder paste which serves to fasten electronic components, such as power semiconductors, to substrates. Components having a structured upper side can be pressure sintered when they are inserted into a receptacle chamber closed by a movable die together with a member of elastically deformable material, such as silicone rubber, which transmits the sintering pressure. The deformable member completely fills out the remaining space of the receptacle chamber when the sintering pressure reached.

Abstract: The reading times for a designational reading of information communicated via an ISDN-oriented interface are formed for a recording device and transmitted thereto with the assistance of a circuit arrangement, being formed from bit clock signals and bit group clock signals, which define the boundaries of the bit groups comprising 32 bits, that are present in an ISDN-oriented interface. The reading times present in the form of bit clock pulses inform the recording device of the times at which the information are to be read and subsequently stored. The circuit arrangement contains a shift register that is formed by a plurality of registers corresponding in number to the plurality of bits of a bit group, a reset device that is realized, for example, by an inverter and a switch, and also contains an AND gate and a plurality of switch devices whose setting determines which information are, respectively, bits of a bit group are to be read and stored.

Abstract: Method for manipulating and/or storing a nuclear reactor fuel assembly including an elongated skeleton structure with fuel rods and a holding device, which includes placing neutron-absorbing material adjacent the fuel rods, fastening a supplemental body with a handle to the skeleton structure, engaging the neutron-absorbing material with the supplemental body, and fitting a coupling part of the holding device to the handle, and a fuel assembly produced according to the method.

Abstract: A method for varying the capacity for a specific chemical element of an ion exchanger used for cleaning a liquid from a loop includes varying the chemical status of the element in the liquid to be cleaned immediately upstream of the ion exchanger by adding given substances. The given substances added are removed immediately downstream of the ion exchanger. The chemical element may be antimony, the loop may be the primary loop of a pressurized water reactor plant and the liquid may be primary coolant.

Abstract: A sorting unit for a switching node comprising a plurality of digital switching matrix networks for fast, asynchronous packet switching networks, which switching node comprises a multi-stage, mixed connection structure based, for example, on a banyan tree structure, that forms a complete truck group, such that every input of the switching node is connectable to every output thereof. The digital switching matrix networks are fashioned as self-controlling (self-routing) sorting units that are a multi-stage circuit switching arrangement comprising 2m-1 beta element columns of m beta elements (.alpha.) each, whereby 2m is equal to the number of inputs and equal to the number of outputs of the sorting unit, and m is a power to two. The sorting unit is divided into a first sub-unit comprising m columns that functions as a distribution unit and a second sub-unit comprising m-1 columns that functions as a correction unit.

Abstract: A method and apparatus for fastening semiconductor components, such as power semiconductors, onto substrates is a diffusion welding method wherein the surfaces to be joined are provided with precious metal contact layers and are pressed together with at least 500 kp/cm.sup.2 at a moderate temperature of approximately 150 to 200 degrees C. Components which have a structured or shaped upper side can be joined to substrates when they are inserted in common with a member of elastically deformable material, such as silicone rubber, into a receptacle chamber that is closed by a movable die which transmits the pressing power. The deformable member completely fills out the remaining interior of the receptacle chamber when the pressing power is reached.

Abstract: An electrically conductive adhesive having elasticity over a wide temperature range of approximately -60.degree. C. to about 180.degree. C. for securing sensitive electronic components to a foundation is provided.

Abstract: A selection device for reliable selection of a plurality of lines or of a plurality of contact locations. In order to select at least two of a plurality of lines, at least two selection lines are connected to every line via a photoresistor, whereby every photoresistor is preferably controllably chargeable with light via a deflectable beam. The selection occurs when selected photoresistors are changed to a low resistance state by light impingement. For selecting at least two of a plurality of contact locations arranged in a grid pattern, the contact locations are connected to the lines via photoresistors. The device of the present invention is preferably utilized for the electrical function testing of printed circuit boards.