Abstract: Version management for manufacturing system software involves a two-part data structure, having two identifiers that are separately and automatically modified, depending upon the changes or modifications that are made, respectively, to top-level and lower-level subsets of manufacturing system programs. According to various other aspects of the present invention, methods for managing revisions involve automatically assigning a version designator under preselected conditions, automatically notifying personnel having a need to know of the change, and managing revisions by way of a revision compare function.

Abstract: Methods and tools for quickly and accurately performing complex customer benefit modeling for an electronic components assembly system are disclosed. In one embodiment, predefined user interfaces allow a consultant, customers, salespersons, or line designers to input a line configuration by selecting from a list predefined objects that represent specific line components. In addition, the user inputs other line configuration data specific to the line being configured. The information contained in the user interface is extracted for use a discrete event simulator. Templates for simulation objects may be created in advance and populated with data from the input interface. A simulation is built and run. Simulation results may be exported to an output means, which may allow for custom generated reports. The reporting means may include a means for allowing customer specific information and data to be inputted.

Abstract: The present invention provides novel naming and manipulation functions for user defined data structures in a data system using transaction service. In particular, in an electronics assembly engineering system having a computer subsystem in which user-defined data structures accessible to editor software have referential integrity and in which user modifications to the data structures during editing are made directly to the data structures rather than indirectly by way of a temporary file, the invention provides a method for permitting naming and manipulation of the data structures. The method includes the steps of (i) providing close, discard and rename functions for the data structures in the case where a newly-created data structure is being edited; (ii) providing close and copy functions for the data structures if an existing data structure is being edited; and (iii) excluding a save-as function for the data structures.

Abstract: A method of controlling thermal loading of an electronic component material during ablation thereof provides a first laser light beam 42 at a certain power density and fluence and uses the first laser light beam to remove a portion of a first side 47 of the material 36. A second laser light beam 44 is provided at a certain power density and fluence and the second laser light beam is used to remove a portion of a side 49 of the material opposing the first side thereof substantially simultaneously as the portion of the first side is being removed.

Abstract: An upcollimator structure 28 for a laser system 10 is provided. The upcollimator structure 28 includes at least one concave lens 40; at least one convex lens 42 spaced from the concave lens; and at least one lens member 48 composed at least in part of piezoelectric material disposed between the lenses. When voltage is applied to the lens member 48, a refractive index of the lens member changes thus changing an upcollimation factor when a light beam is passed through the upcollimator structure. The lens member can be moved with respect to the convex lens and the concave lens thereby changing the upcollimation and focal point of the light beam as the light beam exits the optical.

Abstract: A method and structure of ex-situ polymer stud grid array (ESWS-PSGA) contact formation on a semiconductor wafer having individual integrated circuit (IC) device areas. A large area of a polymer stud grid array (PSGA) field, including a polymer film, is pre-fabricated and then interconnected with the semiconductor wafer, and the ESWS-PSGA is formed using methods including laser structuring, compression molding, photolithographic-plasma etching, photolithographic processing, or adding material to the surface of the polymer film. The ESWS-PSGA has the PSGA field extend across the entire active surface of the semiconductor wafer, with metallized PSGA input/output (I/O) studs being disposed across the individual IC device areas. Alternatively, the ESWS-PSGA can be formed by spreading an extension of the polymer film beyond the perimeter of the semiconductor wafer, with metallized PSGA input/output (I/O) studs being disposed across the individual IC device areas.

Abstract: Methods and structures of in-situ wafer scale polymer stud grid array (ISWS-PSGA) contact formation on integrated circuit devices, wherein a separate pre-manufactured PSGA substrate is not needed. The methods include injection molding of thermoplastics, transfer-molding of thermoset materials, lamination of polymer films with subsequent in-situ molding/embossing, and forming the PSGA structure directly on the semiconductor wafer. The ISWS-PSGA structure extends across the entire semiconductor wafer, with ISWS-PSGA metallized input/output studs disposed across each of the integrated circuit devices on the wafer. The polymer formed on the wafer surface to create the stud field is extended beyond the perimeter of the wafer, and the polymer film extension is used for temporary connection to an integrated circuit tester, or an integrated circuit test/burn-in system. The extension may further include studs for contacting the tester.