Patents Assigned to Siemens Matsushita Components GmbH & Co. KG
  • Patent number: 6449828
    Abstract: A method of making a SAW component has electrically conductive structures on a substrate. A cap cover encapsulates and seals the structures against environmental influences. An RF shield is placed on the cap cover. The RF shield is a metallization formed of a material layer sequence of TiW, Cu or Ni and Au which is then reinforced with current-less or galvanic deposition.
    Type: Grant
    Filed: February 28, 2001
    Date of Patent: September 17, 2002
    Assignee: Siemens Matsushita Components GmbH & Co. KG
    Inventors: Wolfgang Pahl, Alois Stelzl, Hans Krüger
  • Patent number: 6446316
    Abstract: An encapsulation for SAW components and a method for producing the encapsulation use a cap to seal component structures on a substrate. The cap is in the form of a cover on the substrate and has cutouts which accommodate the component structures in regions of the component structures.
    Type: Grant
    Filed: June 17, 1998
    Date of Patent: September 10, 2002
    Assignee: Siemens Matsushita Components GmbH & Co. KG
    Inventors: Bruno Fürbacher, Friedrich Lupp, Wolfgang Pahl, Günter Trausch
  • Patent number: 6409545
    Abstract: The invention relates to a power capacitor for use in capacitor banks, which is build into a housing and interconnected by ribbon cables.
    Type: Grant
    Filed: October 10, 2000
    Date of Patent: June 25, 2002
    Assignee: Siemens Matsushita Components GmbH & Co. KG
    Inventors: Harald Vetter, Ludwig Berg
  • Patent number: 6323750
    Abstract: An electrical component is installed in a plastic cup. The component has two electrical connecting lines, and a parting location that is bridged by a solder metal is arranged in one lead. In addition, a prestressed spring is arranged at the one lead for removing the lead from the parting location during melting of the solder metal as a result of an overload, so that the component is disconnected from a current source. The one lead is pinched to a thickness of 0.2-0.5 mm.
    Type: Grant
    Filed: October 25, 1999
    Date of Patent: November 27, 2001
    Assignees: Siemens Matsushita Components GmbH & Co. KG, Karl Jungbecker GmbH & Co.
    Inventors: Ewald Lampl, Peter Nöhrer, Martin Schwingenschuh, Andreas Hesse
  • Patent number: 6307306
    Abstract: A piezo actuator (1) is disclosed that has a contact lug (20, 21) for the electrical contacting of an electrode (14, 15) of an actuator member (11). Due to an expansion and contraction of the actuator member, a mechanical stress occurs in the contact lug that is minimized in that the contact lug has a device for adapting the expanse to a dimension of the expansion and contraction. The device is, for example, a deformation material in the form of a wire weave. The piezo actuator is utilized for the drive of an injection valve in an internal combustion engine.
    Type: Grant
    Filed: August 6, 1999
    Date of Patent: October 23, 2001
    Assignees: Siemens Aktiengesellschaft, Siemens Matsushita Components GmbH & Co. KG
    Inventors: Ulrich Bast, Dieter Cramer, Gerald Kainz, Carsten Schuh, Andreas Wolff, Karl Lubitz
  • Patent number: 6281777
    Abstract: An inductive component for the attenuation of common mode and push-pull interferences in n-lead systems with n≧2 leads, includes a body of a permeable material having n bores formed therein. Electric leads are disposed in the bores.
    Type: Grant
    Filed: January 6, 1997
    Date of Patent: August 28, 2001
    Assignee: Siemens Matsushita Components GmbH & Co. KG
    Inventors: Peter Aufleger, Herbert Baschke
  • Publication number: 20010010444
    Abstract: The SAW component has electrically conductive structures on a substrate. A cap cover encapsulates and seals the structures against environmental influences. An RF shield is placed on the cap cover. The RF shield is a metallization formed of a material layer sequence of TiW, Cu or Ni and Au which may be reinforced with current-less or galvanic deposition.
    Type: Application
    Filed: February 28, 2001
    Publication date: August 2, 2001
    Applicant: Siemens Matsushita Components GmbH & Co. KG
    Inventors: Wolfgang Pahl, Alois Stelzl, Hans Kruger
  • Patent number: 6259595
    Abstract: An electrical component is installed in a metallic housing having a planar housing floor, in which the housing is pressed against a heat dissipation plate by means of screwable tension elements that are situated adjacent the housing wall. The tension elements have peaks at a portion that faces the housing wall. The housing has an indentation in the clamping region of the tension elements which serves as an aid to assembly, and the center line of the indentation is arranged higher prior to the fixing of the housing by means of the peak of the tension elements than subsequent thereto.
    Type: Grant
    Filed: November 19, 1999
    Date of Patent: July 10, 2001
    Assignee: Siemens Matsushita Components GmbH & Co. KG
    Inventors: Rainer Hebel, Wilhelm Schweikert
  • Patent number: 6249208
    Abstract: A chip inductance is composed of a wound coil core (1) that is arranged erect on a system carrier (6). Perpendicularly residing clips (7) are located on the system carrier, whereby the coil core (1) is arranged within the space formed by the clips. The terminals are thereby located essentially outside the space existing between the end face planes of the coil core (1).
    Type: Grant
    Filed: August 18, 1999
    Date of Patent: June 19, 2001
    Assignee: Siemens Matsushita Components GmbH & Co. KG
    Inventors: Gerhard Proks, Elmar Walter, Hans-Dieter Eckardt, Manfred Espenhain, Jörg-Rudolf Maier, Kurt Marth, Wilfried Scherer
  • Patent number: 6246300
    Abstract: In a passive network, such as a CC array in the form of a chip, internal conductors of a number of capacitors are led out at a longitudinal side surface of a chip wafer as terminals therefor. Common frame electrodes of the number of capacitors are, in contrast, led out at both frontal side surfaces of the chip wafer.
    Type: Grant
    Filed: March 26, 1999
    Date of Patent: June 12, 2001
    Assignee: Siemens Matsushita Components GmbH & Co. KG
    Inventors: Klaus-Dieter Aichholzer, Gerald Kainz
  • Patent number: 6246302
    Abstract: A reactance filter, particularly in a branching circuit (ladder type),with surface wave resonators wherein omission weighted normal finger transducers are employed between reflectors such that the arrangement and plurality of the active fingers of the interdigital transducer are particularly formed for changing the capacitance relationship (static to dynamic capacitance) such that a narrow filter bandwidth is achieved.
    Type: Grant
    Filed: March 19, 1999
    Date of Patent: June 12, 2001
    Assignee: Siemens Matsushita Components GmbH & Co. KG
    Inventors: Peter Müller, Maximilian Pitschi
  • Patent number: 6242842
    Abstract: The SAW component has electrically conductive structures on a substrate. A cap cover encapsulates and seals the structures against environmental influences. An RF shield is placed on the cap cover. The RF shield is a metallization formed of a material layer sequence of TiW, Cu or Ni and Au which may be reinforced with current-less or galvanic deposition.
    Type: Grant
    Filed: June 22, 1998
    Date of Patent: June 5, 2001
    Assignee: Siemens Matsushita Components GmbH & Co. KG
    Inventors: Wolfgang Pahl, Alois Stelzl, Hans Krüger
  • Patent number: 6222715
    Abstract: In order to protect electrical devices against overheating, a thermal fuse is provided which is fitted inside a housing of the electrical device to be protected. The thermal fuse, which consists of low-melting point metal, is provided directly next to a critical element of the electrical device, such as a PTC thermistor, is preferably of U-shaped or V-shaped design, and is arranged such that its vertex is directly next to the critical element.
    Type: Grant
    Filed: March 29, 1999
    Date of Patent: April 24, 2001
    Assignee: Siemens Matsushita Components GmbH & Co. KG
    Inventor: Bernd Gruhn
  • Patent number: 6222721
    Abstract: A regenerable electric capacitor having wound-on layers of plastic foils provided with metal layers of the coatings. The metal layers consist of an alloy and include a variable thickness perpendicular to the longitudinal direction of the foils. As such, the thickness of the metal layers is smallest in the regions bordering metal-free edge strips and it increases towards the opposite side of the foil. In addition, the metal layers have an alloy composition that is different dependent transverse to the direction of run of the foils.
    Type: Grant
    Filed: December 13, 1999
    Date of Patent: April 24, 2001
    Assignee: Siemens Matsushita Components GmbH & Co. KG
    Inventor: Harald Vetter
  • Patent number: 6169472
    Abstract: A PCT thermistor arrangement for use in a circuit for demagnetizing shadowmasks of color picture tubes, has at least two PTC thermistor elements which are designed as switching PTC thermistors, are or can be thermally coupled and are or can be electrically connected in parallel.
    Type: Grant
    Filed: July 16, 1999
    Date of Patent: January 2, 2001
    Assignee: Siemens Matsushita Components GmbH & Co. KG
    Inventor: Werner Kahr
  • Patent number: 6160473
    Abstract: In a contact assembly for semiconductor resistors, contact elements (5a, 5b) are designed asymmetrically in such a way that, on mutually opposite side faces of an electrical component (3), they bear on it while being mutually offset.
    Type: Grant
    Filed: February 22, 1999
    Date of Patent: December 12, 2000
    Assignee: Siemens Matsushita Components GmbH & Co. KG
    Inventor: Bernd Gruhn
  • Patent number: 6127040
    Abstract: Electroceramic component having a component body (10), connection metallization coatings (2, 3) and also a protective encapsulation (15 to 18) made of two different materials on in each case two mutually opposite areas of the component body (10) which are free from the connection metallization coatings (2, 3).
    Type: Grant
    Filed: February 22, 1999
    Date of Patent: October 3, 2000
    Assignee: Siemens Matsushita Components GmbH & Co. KG
    Inventors: Peter Grobbauer, Gunter Ott, Heinrich Zodl
  • Patent number: 6081172
    Abstract: Surface wave filter for asymmetrical/symmetrical and symmetrical/symmetrical operating mode, with interdigital output transformers (IDT2, IDT4) connected in series.
    Type: Grant
    Filed: February 25, 1999
    Date of Patent: June 27, 2000
    Assignee: Siemens Matsushita Components GmbH & Co. KG
    Inventors: Georg Strauss, Josef Bauregger
  • Patent number: 6060964
    Abstract: The surface acoustic wave (SAW) filter has two or more identical acoustic tracks. The input side of the tracks is electrically connected in parallel and the output side is electrically connected in series, whereby the impedance of input side of the SAW filter is reduced relative to the impedance of the individual acoustic tracks.
    Type: Grant
    Filed: June 19, 1998
    Date of Patent: May 9, 2000
    Assignee: Siemens Matsushita Components GmbH & Co. KG
    Inventors: Thomas Baier, Jurgen Machui, Isidor Schropp, Gunter Muller
  • Patent number: 5939965
    Abstract: An inductive component with variable magnetic properties. A magnetic field is inductively generated in a magnetic core by an electrical winding. Electrode coatings are provided on the magnetic core and an electrical field or current is impressed into the magnetic core through the electrodes.
    Type: Grant
    Filed: March 18, 1997
    Date of Patent: August 17, 1999
    Assignee: Siemens Matsushita Components GmbH & Co. KG
    Inventors: Mauricio Esguerra, Helko Meuche