Abstract: A placement apparatus for placing and mounting circuit components or devices in aligned combination with circuit boards. The apparatus includes an imaging system, a first stage moveable in first and second opposite directions between first and second predetermined positions, for positioning the circuit board onto which the component is to be placed within a field of view of the imaging system. A second stage, for holding the circuit component, is movably coupled to the first stage. The apparatus further includes a component pick-up system disposed about the first stage for picking up the circuit component from the second stage and placing the circuit component in a predetermined position on the first stage. The imaging system is coupled to a graphical user interface system for providing a position indicator on a monitor screen, wherein the position indicator identifies the location of a particular feature of the circuit board or the circuit component.

Abstract: A guidance type placement apparatus for placing and mounting integrated circuit (IC) components or devices, especially fine pitch integrated circuit devices (FPD), in aligned combination with printed circuit boards. The apparatus includes an image acquisition processing subsystem. The image acquisition subsystem is operative to generate images of at least one pair of diagonally opposed corners of the placement site and IC device from the same optical perspective.

Abstract: An integrated circuit device support tool which includes a device for providing a vacuum for holding an integrated circuit device to be soldered to a printed circuit board. The tool also includes a plurality of thin, pressure transferring members for pressing the leads of the integrated circuit device against a printed circuit board during soldering. The pressure transferring members are of a thin material so as not to provide a heat sink during the soldering operation.

Abstract: A combined radiative and convective rework system is provided for repair, replacement, removal and rework of an electronic component on a printed circuit board. The system includes a guide for guiding heat-inducing radiation and heated gas towards at least one lead of the electronic component, and for preventing the heat-inducing radiation from damaging the body of the component. A heater, including a source of infrared radiation, provides the heat-inducing radiation and the heated gas. In one embodiment, the guide includes a single funnel cooperative with apparatus for reducing component body heating. In second and third embodiments, the guide includes two concentric funnels which form a volume which is traversed by the heat-inducing radiation and heated gas, and which provide at least one narrow region of heat energy to at least one of the leads, but not directly to the component body.

Abstract: An infrared (IR) heater array apparatus that provides focused lines of IR radiation for soldering integrated circuit components or devices, especially fine pitch integrated circuit devices (FPD), in aligned combination with printed circuit boards. The apparatus is configured for concentric mounting in combination with the placement head of placement apparatus wherein FPDs and other IC devices may be bonded to the circuit board while the device is held in place by the placement apparatus. One preferred embodiment of the apparatus includes an array of IR lamps and associated lamp envelopes and lenses, together with control apparatus for operating the IR lamps and aligning the focused IR radiation generated thereby. The radiation generated by the IR lamps is configured to provide a desired line pattern of energy which is directed onto the leads of a device being soldered. The perimeter of the energy pattern is programmably alterable to suit particular device lead sizes and configurations.

Abstract: A guidance type placement apparatus for placing and mounting integrated circuit (IC) components or devices, especially fine pitch integrated circuit devices (FPD), in aligned combination with printed circuit boards. The apparatus includes a mechanical positioning subsystem, an image acquisition/processing subsystem, a master control subsystem, and optionally, a heater array subsystem. The mechanical positioning subsystem is sequentially operative to position the circuit board and IC device for the generation of images thereof, to align the IC device with a designated placement site on the board, and to mount the IC device in aligned combination with the board. The image acquisition subsystem is operative to generate images of at least one pair of diagonally opposed corners of the placement site and IC device from the same optical perspective. Images generated by the image acquisition subsystem provide feedback control to regulate the placement process to attain and verify lead-to-pad alignment.

Abstract: A guidance type placement apparatus for placing and mounting integrated circuit (IC) components or devices, especially fine pitch integrated circuit devices (FPD), in aligned combination with printed circuit boards. The apparatus includes an image acquisition/processing subsystem. The image acquisition subsystem is operative to generate images of at least one pair of diagonally opposed corners of the placement site and IC device from the same optical perspective. Images generated by the image acquisition subsystem provide feedback control to regulate the placement process to attain and verify lead-to-pad alignment.

Abstract: A contact heater for soldering and desoldering electronic components that is heated by hot air supplied into a cavity of the contact heater. A thermally conductive heating blade is used to contact an area to be heated, while a heat shield protects adjacent electronic components from external heat generated by the contact heater.

Abstract: An infrared (IR) heater array apparatus that provides focused lines of IR radiation for soldering integrated circuit components or devices, especially fine pitch integrated circuit devices (FPD), in aligned combination with printed circuit boards. The apparatus is configured for concentric mounting in combination with the placement head of placement apparatus wherein FPDs and other IC devices may be bonded to the circuit board while the device is held in place by the placement apparatus. One preferred embodiment of the apparatus includes a rectangular frame member having four radiation slits, a rectangular array of four IR lamps and associated lamp envelopes mounted in combination outside the frame member, X and Y pairs of reflecting members rotatably mounted within the frame member, and control subsystems for operating the IR lamps and aligning the focused IR radiation generated thereby.

Abstract: A variable parameter heater for applying heat in a predetermined profile to a work surface. The heater has a plurality of elongated members which are interconnected to form a frame. Elongated members are slidingly adjustable to provide the intended heat profile. Each elongated member contains first and second rows of apertures. Heated air is delivered to the work surface past selectively energized heating elements disposed in the first row of apertures. Cool air where required is delivered to the work surface through the second row of apertures. The heater may include a vacuum probe for depositing or removing components relative to the work surface. The vacuum probe may also direct cool air to the work surface. Mirrors may be mounted upon elongated members to provide enhanced viewing of the work surface. In case of disablement, elongated members are individually removeble for repair or replacement.