Abstract: Vapor phase coating techniques with improved control over the co-transfer and co-deposition of aluminum and reactive element(s) from sources to the article being coated. One method includes providing a reactive element source, wherein at least a portion of the reactive element source comprises a non-halide compound of a reactive element, providing an aluminum source, providing a halide activator, and heating an article having a metallic surface, the reactive element source, the aluminum source, and the halide activator under conditions effective to cause species comprising aluminum and the reactive element to be co-deposited onto said surface to form a coating.

Abstract: A device is provided for brush electroplating a surface of a workpiece. The device includes an anode generally composed of a metal to be electroplated on the surface of the workpiece. The anode is selectively retained within a cavity formed in a lower surface of a carrier piece composed of a generally electrical non-conductive material. The lower surface of the carrier piece is shaped to conform to at least a portion of the surface of the workpiece. An absorbent material extends over the lower surface of the carrier piece to form a brush. The cover material and lower surface of the anode are spaced from each other to form a chamber. The device also includes an assembly, fluidly connected to the space between the anode and absorbent material, to inject a flow of the electrolytic fluid into the chamber.

Abstract: An apparatus for electroplating a selected surface of a workpiece, or electrolytically or chemically stripping a plating therefrom, comprises an electrode or center constrictor member having an active surface with a selected shape to combine with the selected surface of the workpiece to define an elongated gap of at least about 0.050 inches therebetween, means for supporting this constrictor member in a fixed position to define the elongated gap; solution circulating means for forcing a stripping solution through the gap in a generally closed path at a velocity to exchange stripping solution in the gap at a rate of at least 25 times per minute. When used for either electroplating or electrolytically stripping, the apparatus is provided with means for applying current flow between the selected workpiece surface and the active surface of the electrode through the gap at a current density of at least 2.0 amperes/in.sup.2.

Abstract: An electroplating apparatus for rapidly depositing a metal onto a selected surface of a workpiece, which apparatus comprises an anode having an active surface with a selected shape to combine with the selected surface of the workpiece to define an elongated gap of at least about 0.050 inches, means for supporting this anode in a fixed position to define the elongated gap; solution circulating means for forcing an electroplating solution with metal cations through the gap in a generally closed path at a velocity to exchange electroplating solution in the gap at a rate of at least 25 times per minute; and, means for applying current flow between the selected workpiece surface and the active surface of the anode through the gap at a current density in excess of 2.0 amperes/in.sup.2. The invention also involves the method of using this apparatus to rapidly deposit metal, such as nickel, onto the inner cylindrical surface of a bore on a complex part such as an aircraft landing gear forging.

Abstract: An electroplating apparatus for rapidly depositing a metal onto a selected surface of a workpiece, which apparatus comprises an anode having an active surface with a selected shape to combine with the selected surface of the workpiece to define an elongated gap of at least about 0.050 inches, means for supporting this anode in a fixed position to define the elongated gap; solution circulating means for forcing an electroplating solution with metal cations through the gap in a generally closed path at a velocity to exchange electroplating solution in the gap at a rate of at least 25 times per minute; and, means for applying current flow between the selected workpiece surface and the active surface of the anode through the gap at a current density in excess of 2.0 amperes/in.sup.2. The invention also involves the method of using this apparatus to rapidly deposit metal, such as nickel, onto the inner cylindrical surface of a bore on a complex part such as an aircraft landing gear forging.

Abstract: An apparatus for electrolytically plating, cleaning, or otherwise treating a surface of revolution of a metallic workpiece. The treatment is carried out by a pair of electrodes each having a conductive portion and a porous dielectric cover that engages the surface to be treated. The electrodes are resiliently supported by an arm that is mounted on a shaft that is coaxial with the surface of revolution to be treated. The arm has portions extending radially outwardly from the shaft, each portion being provided with a resilient member to which an electrode is secured so that when the shaft is rotated the electrodes are moved in a circular path and are resiliently urged into engagement with the surface to be treated. Means are provided for supplying electrolyte to the electrodes and for supplying electric current to the workpiece and the electrodes to carry out the electrolytic treatment.

Abstract: A method and apparatus for soldering aluminum are disclosed. According to the method, the aluminum surface to be soldered is subject to conventional cleaning, then electrolytic cleaning and electrolytic etching, followed by electroplating a very thin layer of nickel on the cleaned and etched surface. The electrolytic cleaning, etching, and plating operations are all carried out by the use of a brush plating tool having an insulated handle portion, to one end of which a wire electrode encased in a porous covering composed of polyester felt is secured.After the plating has been completed, the surface may be soldered with conventional soft solders and non-corrosive fluxes, using conventional soldering techniques.