Patents Assigned to SIGMA INNOVATION TECHNOLOGY INC.
  • DIAMOND ABRASIVE GRAIN AND ELECTROPLATED TOOL HAVING THE SAME
    Publication number: 20130291445
    Abstract: A coating method on diamond abrasive grains is used to form a conductive film on diamond abrasive grains. The conductive film has chemical composition gradient giving the diamond abrasive grain an outwardly increasing electrical conductibility as a function of film thickness. The subsequent electroplating layer can therefore more effectively embed the modified diamond abrasive grains, whilst the adhesion/bonding strength between substrate (work piece for electroplating) and the diamond abrasive grains is improved.
    Type: Application
    Filed: May 1, 2012
    Publication date: November 7, 2013
    Applicant: SIGMA INNOVATION TECHNOLOGY INC.
    Inventors: WEN-TUNG CHEN, JU-LIANG HE