Patents Assigned to Sigma P.I. Co., Ltd.
  • Patent number: 10204250
    Abstract: The objective of the present invention is to effectively prevent fraud, theft, and the like occurring with respect to a medium manufactured from a source material. This medium is a medium that is cut into a prescribed shape from a source material on which an identifier capable of specifying a location and capable of being read by a reading device is attached at a corresponding location. The prescribed location on the medium is specified as an authentication location enabling recognition of the medium, and at least a portion of the identifier capable of specifying the prescribed location is set as an identifier of the medium.
    Type: Grant
    Filed: June 24, 2016
    Date of Patent: February 12, 2019
    Assignee: SIGMA P.I. CO., LTD.
    Inventor: Yoshitaka Shimada
  • Patent number: 5947297
    Abstract: The packaging case comprises, when assembled, a back part (aback hanging board), a bottom part (a bottom cover), a front part (a front cover, a front hanging board), the boards and covers being formed continuously in this order and bordered by fold lines, and a side part (a side cover, a glue margin) continuously extending from each side edge of the front cover except the neighborhood of the front hanging board and bordered by fold lines. A window is formed in the front cover, and a hook hole is respectively punched in the front and the back hanging boards to make a single matching hook hole. In one side edge of the back hanging board, a U-shaped perforated tear portion is provided for tearing off a part of the side edge glued to a corresponding glue margin.
    Type: Grant
    Filed: August 19, 1998
    Date of Patent: September 7, 1999
    Assignees: Sigma P.I. Co., Ltd., Sony Corporation
    Inventors: Yoshiharu Aoki, Masahiko Ito, Hisashi Nakano