Patents Assigned to SIGMA TECHNOLOGIES INT'L., LLC
  • Patent number: 11072148
    Abstract: Material for packaging—and package or receptacle made of such material—that contains a particular aluminized polymeric film with emissivity of equal to, or less than 0.10 and yet sufficiently thin to withstand and satisfy industrial requirements of the recycling process due to substantially complete oxidization of aluminum during the recycling. An optional protective coating (less than one micron in thickness) may be added to protect aluminum in the film from corrosion during the normal use of the packaging. Protective coating is configured to not raise emissivity of the aluminized surface above the 0.10 value and, at the same time, to still allow for the aluminum material it covers to be removed due to becoming fully oxidized and corroded in the heat and at humidity levels used in the recycling/repulping process. Proposed configuration permits the aluminum of the packaging material to be included in the recycled portion of the packaging material.
    Type: Grant
    Filed: January 3, 2019
    Date of Patent: July 27, 2021
    Assignee: SIGMA TECHNOLOGIES INT'L, LLC
    Inventors: Steven Yializis, Luke Rogers
  • Patent number: 10347422
    Abstract: Prismatic polymer monolithic capacitor structure operating at temperatures exceeding 140° C. and including multiple interleaving radiation-cured polymer dielectric layers and metal layers. Method for fabrication of same. The geometry of structure is judiciously chosen to increase sheet resistance of metal electrodes while reducing the capacitor's equivalent series resistance. Metal electrode layers are provided with a thickened peripheral portion to increase strength of terminating connections and are passivated to increase corrosion resistance. Materials for polymer dielectric layers are devised to ensure that the capacitor's dissipation factor remains substantially unchanged across the whole range of operating temperatures, to procure glass transition temperature that is no less than the desired operating temperature, and to optimize the absorption of ambient moisture by the polymeric layers.
    Type: Grant
    Filed: April 10, 2017
    Date of Patent: July 9, 2019
    Assignee: SIGMA TECHNOLOGIES, INT'L, LLC
    Inventor: Angelo Yializis
  • Patent number: 10102974
    Abstract: Prismatic polymer monolithic capacitor structure including multiple interleaving radiation-cured polymer dielectric layers and metal layers. Method for fabrication of same. The chemical composition of polymer dielectric and the electrode resistivity parameters are chosen to maximize the capacitor self-healing properties and energy density, and to assure the stability of the capacitance and dissipation factor over the operating temperature range. The glass transition temperature of the polymer dielectric is specifically chosen to avoid mechanical relaxation from occurring in the operating temperature range, which prevents high moisture permeation into the structure (which can lead to higher dissipation factor and electrode corrosion). The geometry and shape of the capacitor are appropriately controlled to minimize losses when the capacitor is exposed to pulse and alternating currents.
    Type: Grant
    Filed: June 16, 2017
    Date of Patent: October 16, 2018
    Assignee: SIGMA TECHNOLOGIES INT'L., LLC
    Inventor: Angelo Yializis