Abstract: A heat treatment apparatus permits manufacture of a high-accuracy resist pattern by reducing a temperature difference within a substrate surface in the transition state of heating or cooling the substrate and the steady state. The heat treatment apparatus includes a thermal plate having a main surface containing a first area on which the substrate is to be placed and a second area surrounding the first area, heat capacity per unit area in the second area of the main surface being smaller than heat capacity per unit area in the first area of the main surface; and a temperature control element for controlling temperature of the thermal plate in accordance with supplied current.