Abstract: An example method includes obtaining annotated source code and based at least in part on a first annotation, separating the source code into first and second source code portions. The method also includes generating from the first source code portion a first source code stream to be supplied for compilation by a first compiler, the first source code stream augmented, based on the first annotation, to include additional coordination code not present in the obtained source code, and the first compiler specific to the first-type subset of the target CPUs. The method further includes generating from the second source code portion a second source code stream to be supplied for compilation by a second compiler, the second compiler specific to a second-type subset of the target CPUs. The target CPUs of the first- and second-type subsets have one or more different functionalities.

Abstract: A method and system for thermal management in integrated circuits and integrated circuit boards is described. In an embodiment, the circuit device board includes circuit devices, temperature sensors, and a thermal management unit. The thermal management unit receives thermal data from the temperature sensors and determines thermal reference points that define thermal regions. The thermal reference points are correlated with the operating characteristics of the circuit devices. When warranted, the thermal management unit makes independent corrective responses to each of the thermal regions. These corrective responses include modifying operating parameters, adjusting workload, and suspending operation of circuit devices within the thermal region. Thus, the disclosed method and system can preserve function in one thermal region while alleviating stress on another thermal region.

Abstract: A method and system for thermal management in integrated circuits and integrated circuit boards is described. In an embodiment, the circuit device board includes circuit devices, temperature sensors, and a thermal management unit. The thermal management unit receives thermal data from the temperature sensors and determines thermal reference points that define thermal regions. The thermal reference points are correlated with the operating characteristics of the circuit devices. When warranted, the thermal management unit makes independent corrective responses to each of the thermal regions. These corrective responses include modifying operating parameters, adjusting workload, and suspending operation of circuit devices within the thermal region. Thus, the disclosed method and system can preserve function in one thermal region while alleviating stress on another thermal region.

Abstract: A method and system for thermal management in integrated circuits and integrated circuit boards is described. In an embodiment, the circuit device board includes circuit devices, temperature sensors, and a thermal management unit. The thermal management unit receives thermal data from the temperature sensors and determines thermal reference points that define thermal regions. The thermal reference points are correlated with the operating characteristics of the circuit devices. When warranted, the thermal management unit makes independent corrective responses to each of the thermal regions. These corrective responses include modifying operating parameters, adjusting workload, and suspending operation of circuit devices within the thermal region. Thus, the disclosed method and system can preserve function in one thermal region while alleviating stress on another thermal region.

Abstract: A method and system for thermal management in integrated circuits and integrated circuit boards is described. In an embodiment, the circuit device board includes circuit devices, temperature sensors, and a thermal management unit. The thermal management unit receives thermal data from the temperature sensors and determines thermal reference points that define thermal regions. The thermal reference points are correlated with the operating characteristics of the circuit devices. When warranted, the thermal management unit makes independent corrective responses to each of the thermal regions. These corrective responses include modifying operating parameters, adjusting workload, and suspending operation of circuit devices within the thermal region. Thus, the disclosed method and system can preserve function in one thermal region while alleviating stress on another thermal region.