Patents Assigned to Signetron Inc.
  • Patent number: 11810249
    Abstract: Methods for processing a 3D point cloud of a building into polygons using an electronic computing device are presented, the methods including: causing the electronic computing device to receive the 3D point cloud; causing the electronic computing device to segment the 3D point cloud into a number of facades; and causing the electronic computing device to generate a number of polygons representing the number of facades. In some embodiments, the causing the electronic computing device to segment the 3D point cloud into a number of facades includes: performing voxel downsampling operation on the 3D point cloud; calculating a point normal for every point in the voxel downsampled 3D point cloud; and performing region growing to find each of the number of facades.
    Type: Grant
    Filed: January 3, 2022
    Date of Patent: November 7, 2023
    Assignee: Signetron Inc.
    Inventors: Richard Wang, Avideh Zakhor