Patents Assigned to Sigo Co., Ltd.
  • Semiconductor chip flipping assembly and apparatus for bonding semiconductor chip using the same
    Patent number: 7598729
    Abstract: A semiconductor chip flipping assembly and an apparatus for bonding a semiconductor chip using the same are disclosed. In accordance with the semiconductor chip flipping assembly and the apparatus for bonding a semiconductor chip using the same, a front surface of a wafer is mounted in a wafer holder to face downward. Each of dies of the wafer is then pushed downward to a tray disposed therebelow, thereby eliminating a need for a separate flipping process of the semiconductor chip and two or more robot arms.
    Type: Grant
    Filed: June 19, 2007
    Date of Patent: October 6, 2009
    Assignee: Sigo Co., Ltd.
    Inventor: Sung Chul Kim
  • Method for bonding semiconductor chip
    Patent number: 7534703
    Abstract: A method for bonding a semiconductor chip is disclosed. In accordance with the method of the present invention, a front surface of a wafer is mounted in a wafer holder to face downward. Each of dies of the wafer is then pushed downward to a tray disposed therebelow, thereby eliminating a need for a separate flipping process of the semiconductor chip and two or more robot arms.
    Type: Grant
    Filed: June 19, 2007
    Date of Patent: May 19, 2009
    Assignee: Sigo Co., Ltd.
    Inventor: Sung Chul Kim
  • Semiconductor Chip Flipping Assembly and Apparatus For Bonding Semiconductor Chip Using The Same
    Publication number: 20070296445
    Abstract: A semiconductor chip flipping assembly and an apparatus for bonding a semiconductor chip using the same are disclosed. In accordance with the semiconductor chip flipping assembly and the apparatus for bonding a semiconductor chip using the same, a front surface of a wafer is mounted in a wafer holder to face downward. Each of dies of the wafer is then pushed downward to a tray disposed therebelow, thereby eliminating a need for a separate flipping process of the semiconductor chip and two or more robot arms.
    Type: Application
    Filed: June 19, 2007
    Publication date: December 27, 2007
    Applicant: SIGO Co., Ltd.
    Inventor: Sung Chul Kim
  • Method For Bonding Semiconductor Chip
    Publication number: 20070298539
    Abstract: A method for bonding a semiconductor chip is disclosed. In accordance with the method of the present invention, a front surface of a wafer is mounted in a wafer holder to face downward. Each of dies of the wafer is then pushed downward to a tray disposed therebelow, thereby eliminating a need for a separate flipping process of the semiconductor chip and two or more robot arms.
    Type: Application
    Filed: June 19, 2007
    Publication date: December 27, 2007
    Applicant: SIGO Co., Ltd.
    Inventor: Sung Chul KIM