Abstract: A liquid droplet ejection device includes a first liquid droplet ejection unit including a first liquid holding unit configured to hold a first liquid and a first tip configured to eject a first liquid of the first liquid holding unit as a first liquid droplet, a second liquid droplet ejection unit including a second liquid holding unit configured to hold a second liquid and a second configured tip to eject the second liquid of the second liquid holding unit as a second liquid droplet differing from the first liquid droplet, an object holding unit configured to hold an object the first liquid and the second liquid being ejected to the object, and a driving unit configured to move the first tip and the second tip in a first direction relative to the object holding unit, and the first tip is arranged in the first direction relative to the second tip.

Abstract: A liquid droplet ejection device includes at least one first liquid droplet ejection unit including a first liquid holding unit and a first tip, the first tip to eject the first liquid in the first liquid holding unit as a first liquid droplet onto an object; at least one second liquid droplet ejection unit including a second liquid holding unit and a second tip, the second tip to eject the second liquid in the second liquid holding unit as a second liquid droplet onto the object; an object holding unit to hold the object; and a driving unit to move the first tip and the second tip in a first direction. An inner diameter of the second tip is larger than an inner diameter of the first tip. The first tip and the second tip are arranged along the first direction. The second tip is arranged behind the first tip.

Abstract: A hole formation method including applying a pillar-forming liquid to a base material, to thereby form a pillar; applying an insulating film-forming material to the base material on which the pillar has been formed, to thereby form an insulating film; removing the pillar to form an opening in the insulating film; and heat treating the insulating film in which the opening has been formed.

Abstract: A hole formation method including applying a pillar-forming liquid to a base material, to thereby form a pillar; applying an insulating film-forming material to the base material on which the pillar has been formed, to thereby form an insulating film; removing the pillar to form an opening in the insulating film; and heat treating the insulating film in which the opening has been formed.

Abstract: A method of producing a three-dimensional structure contains the steps of: arranging a substrate close to a tip of a needle-shaped fluid-ejection body having a fine diameter supplied with a solution, ejecting a fluid droplet having an ultra-fine diameter toward a surface of the substrate by applying a voltage having a prescribed waveform to the needle-shaped fluid-ejection body, making the droplet fly and land on the substrate, and solidifying the droplet after the fluid droplet is landed on the substrate; further a three-dimensional structure has a fine diameter comprises droplets having an ultra-fine particle diameter, wherein the structure is grown by solidifying the droplets and stacking the solidified droplets.