Abstract: An adhesive compositions containing at least one first styrene-isoprene-styrene block copolymer having a diblock content of not less than 45%, at least one second styrene-isoprene-styrene block copolymer having a styrene content of not more than 30 wt.-%, at least one first tackifying resin having a softening point of equal to or higher than 100° C., and at least one second tackifying resin having a softening point of equal to or higher than 120° C. Further, a method for bonding substrates together using the adhesive composition.

Abstract: Two-component adhesives (K), which includes two components K1 and K2. Component K1 includes at least one epoxy resin A with more than one epoxy group per molecule on average; at least one epoxy adduct B with more than one epoxy group per molecule on average that is an epoxy adduct of type B1 and optionally combined with an epoxy adduct of type B2; at least one reaction product F between an epoxy adduct B and a compound C, which has at least two isocyanate groups, in addition to at least one curing agent D for epoxy resins, which is activated by increased temperature. The component K2 comprises a compound E, which includes at least two isocyanate groups.

Abstract: Disclosed is a force-applying element including a tensioning anchor for anchoring a tape-shaped material to a support structure. The tape-shaped material is pretensioned by means of the tensioning anchor. An extension element is disposed in the transition area between the tensioning anchor and the tape-shaped material following the tensioning process. The extension element is effectively connected to the tape-shaped material and the tensioning anchor.