Patents Assigned to Siklu Communication Ltd.
  • Patent number: 9496593
    Abstract: Various embodiments of a millimeter-wave system operative to enhance propagation of millimeter-waves inside a laminate waveguide structure, in which electrical energy has leaked outside the laminated waveguide structure. The system comprises a laminate waveguide structure inside a printed circuit board, and an electrically conductive fence also inside the printed circuit board but outside the laminate waveguide structure. In various embodiments, the electrical energy of millimeter-waves leaks outside the laminate waveguide structure and is reflected by the electrically conducive fence back into the laminate waveguide structure.
    Type: Grant
    Filed: June 18, 2013
    Date of Patent: November 15, 2016
    Assignee: Siklu Communication Ltd.
    Inventors: Elad Dayan, Yigal Leiba
  • Publication number: 20160308277
    Abstract: Various embodiments of a millimeter-wave wireless point-to-point or point-to-multipoint communication system which enables determining preferred directions of transmissions, and transmitting in such preferred directions without routing radio-frequency signals. The system comprises a millimeter-wave focusing element, multiple millimeter-wave antennas, and multiple radio-frequency-integrated circuits (“RFICs”). In various embodiments, preferred directions are determined, and millimeter-wave beams are transmitted in the preferred directions.
    Type: Application
    Filed: June 28, 2016
    Publication date: October 20, 2016
    Applicant: Siklu Communication Ltd.
    Inventors: Yigal Leiba, Boris Maysel
  • Publication number: 20160277209
    Abstract: Various systems and methods for fault-tolerant and otherwise optimized communication, in which a system includes communication nodes connected by wireless data links together forming a ring structure, as well as additional wireless data links operative to partition the ring structure into multiple sub-ring structures. The system is operative to select, per each of the sub-ring structures, one of the wireless data links to remain dormant, thereby effectively creating a certain communication tree structure. The system is further operative, upon detecting a communication problem or inefficiency in any or all of the sub-ring structures, to shut-down, per sub-ring structure detected, the problematic or otherwise inefficient wireless data link, and to reactivate instead the dormant wireless data link, thereby effectively switching to a new communication tree structure, and thus resolving the problem or otherwise improving efficiency.
    Type: Application
    Filed: May 26, 2016
    Publication date: September 22, 2016
    Applicant: Siklu Communication Ltd.
    Inventors: Yigal Leiba, Izhak Kirshenbaum, Leonid Shousterman
  • Patent number: 9425985
    Abstract: A system for protection switching in radio networks includes a plurality of nodes, a plurality of links of Ethernet interconnecting the nodes and forming a network, at least one wireless link interconnecting two of the nodes, and two Virtual Local Area Networks (VLAN) within the network, only the first VLAN comprising the wireless link. The network transports packets of Ethernet associated with a first Classes of Service (CoS) and a second CoS via the first VLAN. Upon detection of a reduction in performance of the wireless link, the network maps the second CoS to the second VLAN, and by that offloading traffic associated with the second CoS from the wireless link.
    Type: Grant
    Filed: August 31, 2010
    Date of Patent: August 23, 2016
    Assignee: Siklu Communication Ltd.
    Inventors: Leonid Shousterman, Yigal Leiba
  • Patent number: 9413078
    Abstract: Various embodiments of a millimeter-wave wireless point-to-point or point-to-multipoint communication system which enables determining preferred directions of transmissions, and transmitting in such preferred directions without routing radio-frequency signals. The system comprises a millimeter-wave focusing element, multiple millimeter-wave antennas, and multiple radio-frequency-integrated circuits (“RFICs”). In various embodiments, preferred directions are determined, and millimeter-wave beams are transmitted in the preferred directions.
    Type: Grant
    Filed: June 16, 2013
    Date of Patent: August 9, 2016
    Assignee: Siklu Communication Ltd.
    Inventors: Yigal Leiba, Boris Maysel
  • Patent number: 9270005
    Abstract: Various embodiments of millimeter-wave systems on a printed circuit board, including a microstrip, a probe, and an RF integrated circuit, as well as methods for manufacturing said systems. Various embodiments have holes extending through lamina in the PCB, thereby improving radiation propagation. Various embodiments have conductive cages created by multiple through-holes extending through lamina in the PCB, thereby increasing radiation propagation. The manufacture of such systems is easier and less expensive than the manufacture of current systems.
    Type: Grant
    Filed: June 20, 2012
    Date of Patent: February 23, 2016
    Assignee: Siklu Communication Ltd.
    Inventors: Yigal Leiba, Elad Dayan
  • Patent number: 9203691
    Abstract: Various embodiments of a fail-safe communication system in which certain communication components fail, the system detects the failure, and the system maintains communication by routing data sets to different communication components. In various embodiments, the communication components fail on the network side. In various embodiments, the communication components fail on the remote side. In various embodiments, there are methods for fail-safe communication in which a system detects communication component failure, and routes data sets to other communication components.
    Type: Grant
    Filed: June 20, 2012
    Date of Patent: December 1, 2015
    Assignee: Siklu Communication Ltd.
    Inventors: Baruch Schwarz, Ariel Picholtz, Yigal Leiba
  • Patent number: 9196950
    Abstract: Various embodiments of a millimeter-wave wireless point-to-point or point-to-multipoint communication system which maintains a stable communication link even in the face of mechanical vibration of the transceivers. The system comprises a transmitter, a receiver, a high-gain antenna, and allied equipment as described. In various embodiments, the system is planned and engineered to maintain the communication link even at a maximum vibration of X/2 degrees in either an up or down direction. In some embodiments, the system uses the energy of a concentrated horizontal beam-width to compensation for the energy pattern in a dispersed vertical beam-width. The system may be set to compensate for different degrees of vibration. The system may be set to maintain different degrees of communication gain.
    Type: Grant
    Filed: December 11, 2012
    Date of Patent: November 24, 2015
    Assignee: Siklu Communication Ltd.
    Inventor: Yigal Leiba
  • Patent number: 8964883
    Abstract: A clock extractor extracts clock frequency f2, from a wired data connection feeding the transmitter with data clocked at the clock frequency f2. A clock error estimator estimates clock frequency error between the clock frequency f2 and a clock frequency f1 derived from a local clock of the transmitter. Clock adder adds the clock frequency error to the clock frequency f1, resulting in a synthesized clock frequency f2. A modulator uses the synthesized clock frequency f2, to modulate a data stream into a modulated signal.
    Type: Grant
    Filed: December 25, 2012
    Date of Patent: February 24, 2015
    Assignee: Siklu Communication Ltd.
    Inventors: Boris Maysel, Yigal Leiba
  • Patent number: 8914968
    Abstract: A method for constructing millimeter-wave laminate structures using Printed Circuit Board (PCB) processes includes the following steps: Creating a first pressed laminate structure comprising at least two laminas and a cavity, the cavity is shaped as an aperture of a waveguide, and goes perpendicularly through all laminas of the laminate structure. Plating the cavity with electrically conductive plating, using a PCB plating process. Pressing the first pressed laminate structure together with at least two additional laminas comprising a probe printed on one of the at least two additional laminas, into a PCB comprising the first pressed laminate structure and the additional laminas, such that the cavity is sealed only from one end by the additional laminas and the probe, and the probe is positioned above the cavity.
    Type: Grant
    Filed: February 21, 2011
    Date of Patent: December 23, 2014
    Assignee: Siklu Communication Ltd.
    Inventors: Elad Dayan, Yigal Leiba, Baruch Schwarz, Amir Shmuel
  • Patent number: 8917151
    Abstract: A system for injecting and guiding millimeter-waves through a Printed Circuit Board (PCB) including at least two laminas belonging to a PCB, an electrically conductive plating applied on the insulating walls of a cavity formed perpendicularly through the laminas, and optionally a probe located above the cavity printed on a lamina belonging to the PCB. Optionally, the cavity guides millimeter-waves injected by the probe at one side of the cavity to the other side of the cavity.
    Type: Grant
    Filed: February 21, 2011
    Date of Patent: December 23, 2014
    Assignee: Siklu Communication Ltd.
    Inventors: Elad Dayan, Yigal Leiba, Baruch Schwarz, Amir Shmuel
  • Publication number: 20140368385
    Abstract: Various embodiments of a communication system operative to form, direct, and narrow communication beams using an array of electromagnetic radiators and a beam-narrowing architecture. A beam-width of an electromagnetic beam is narrowed, thereby increasing the concentration of electromagnetic energy in the beam and achieving a significant antenna gain. In various embodiments, the direction of an electromagnetic beam may be altered to improve communication between a transmitter and a receiver. In various embodiments, the system is a millimeter-wave system with a millimeter-wave array and millimeter-wave beams.
    Type: Application
    Filed: June 20, 2014
    Publication date: December 18, 2014
    Applicant: Siklu Communication Ltd.
    Inventors: Ovadia Haluba, Naftali Chayat, Yigal Leiba, Itzik Ben Bassat, Boris Maysel
  • Patent number: 8912862
    Abstract: A system for matching impedances of a bare-die Integrated Circuit and bonding wires. A bare-die Integrated Circuit is configured to output or input, at an impedance of Z3, a millimeter-wave signal from three electrically conductive contacts. Three electrically conductive pads, printed on one of the laminas of a Printed Circuit Board (PCB) are connected to the three electrically conductive contacts via three bonding wires respectively, the bonding wires have a characteristic impedance of Z1, wherein Z1>Z3. One of the electrically conductive pads extends to form a transmission line signal trace of length L, the transmission line signal trace having a first width resulting in characteristic impedance of Z2, wherein Z2>Z3. The transmission line signal trace widens to a second width, higher than the first width, after the length of L, decreasing the characteristic impedance of the transmission line signal trace to substantially Z3 after the length L and onwards.
    Type: Grant
    Filed: February 21, 2011
    Date of Patent: December 16, 2014
    Assignee: Siklu Communication Ltd.
    Inventors: Yonatan Biran, Elad Dayan, Yigal Leiba, Baruch Schwarz, Amir Shmuel
  • Patent number: 8912860
    Abstract: A system enabling interface between a millimeter-wave bare-die and a Printed Circuit Board (PCB). A cavity of depth X is formed in at least one lamina of a PCB. Three electrically conductive pads are printed on one of the laminas of the PCB, the pads optionally reach the edge of the cavity. A bare-die Integrated Circuit having a thickness of optionally X, or a heightened bare-die Integrated Circuit having a thickness of optionally X, output a millimeter-wave signal from three electrically conductive contacts arranged in a ground-signal-ground configuration on an upper side edge of the bare-die Integrated Circuit. The bare-die Integrated Circuit is placed inside the cavity, optionally such that the electrically conductive pads and the upper side edge containing the electrically conductive contacts are arranged side-by-side at substantially the same height. Three bonding wires or strips electrically connect each electrically conductive contact to one of the electrically conductive pads.
    Type: Grant
    Filed: February 21, 2011
    Date of Patent: December 16, 2014
    Assignee: Siklu Communication Ltd.
    Inventors: Yigal Leiba, Elad Dayan, Baruch Schwarz, Amir Shmuel
  • Patent number: 8912859
    Abstract: A system for directing electromagnetic millimeter-waves towards a waveguide using an electrically conductive formation within a Printed Circuit Board (PCB). The system includes a waveguide having an aperture and at least two laminas belonging to a PCB. A first electrically conductive surface printed on one of the laminas is located over the aperture such that the first electrically conductive surface covers at least most of the aperture. A plurality of Vertical Interconnect Access (VIA) holes, optionally filled or plated with an electrically conductive material, are electrically connecting the first electrically conductive surface to the waveguide, forming an electrically conductive cage over the aperture. Optionally, a probe printed on one of the laminas of the PCB is located inside the cage and over the aperture.
    Type: Grant
    Filed: February 21, 2011
    Date of Patent: December 16, 2014
    Assignee: Siklu Communication Ltd.
    Inventors: Yigal Leiba, Elad Dayan, Baruch Schwarz, Amir Shmuel
  • Patent number: 8912858
    Abstract: A low-loss interface between a mm-wave integrated circuit and a waveguide comprises a surface having a contact location for said integrated circuit and a waveguide location for fixing a waveguide thereon; a transmission line extending along said surface from said contact location to the waveguide location and extending into the waveguide location as a waveguide feed; and a connection bump on a surface of the mm-wave integrated circuit. The mm-wave integrated circuit RFIC is connected to the surface at the contact location through the connection bump, such as to connect a signal output of the RFIC to the transmission line, thereby providing said low loss interface.
    Type: Grant
    Filed: September 8, 2009
    Date of Patent: December 16, 2014
    Assignee: Siklu Communication Ltd.
    Inventors: Elad Dayan, Amir Shmuel, Yigal Leiba, Baruch Schwarz
  • Patent number: 8830906
    Abstract: A system includes a networking enabled system and a packet radio system. The packet radio system includes a wireless interface and a packet interface. The packet interface includes at least two queues, each queue configured to store a certain class of packets of Ethernet. A cable is operative to transport the packets from the networking enabled system to the packet interface using Ethernet signaling. The packet interface is configured to ascertain from time to time the rate at which the packets are sent from the queues over the wireless interface, and according to the rate, indicate dynamically to the network enabled system the classes of packets for which packets are to be sent over the cable for storage in the appropriate queues. The network enabled system is configured to send, over the cable, packets of classes indicated by the packet interface, while holding back other packets.
    Type: Grant
    Filed: August 31, 2010
    Date of Patent: September 9, 2014
    Assignee: Siklu Communication Ltd.
    Inventors: Leonid Shousterman, Itzhak Ben-Bassat, Yigal Leiba
  • Patent number: 8674885
    Abstract: A millimeter-wave communication system includes (i) an antenna comprising a reflector and a feed, the feed comprising a first waveguide, (ii) a Printed Circuit Board (PCB) comprising a modem, a processor, and a radio receiver coupled with a probe, the PCB is mechanically fixed to one end of the feed, such that the PCB is mechanically held by the feed, and the probe is located in a position allowing reception of millimeter-waves exiting the first waveguide towards the PCB, (iii) an Ethernet connector, (iv) at least one flexible cable operative to carry Ethernet signals between the first PCB and the Ethernet connector, and (v) a box housing the PCB and the Ethernet connector. The Ethernet connector and the feed are mechanically fixed to the box, and the only mechanical connection between the PCB and the box is via the feed.
    Type: Grant
    Filed: August 31, 2010
    Date of Patent: March 18, 2014
    Assignee: Siklu Communication Ltd.
    Inventors: Yigal Leiba, Elad Dayan
  • Patent number: 8674892
    Abstract: A method for accurately guiding millimeter-waves includes the following steps: Filtering millimeter-waves by applying the millimeter-waves at a first shape aperture of a filter waveguide, resulting in filtered millimeter-waves exiting a second shape aperture of the filter waveguide. Transporting the filtered millimeter-waves over a distance of between 9 centimeters and 25 centimeters, by applying the filtered millimeter-waves to an extruded waveguide having a length of between 9 centimeters and 25, and having a cavity featuring a cross-section that is accurate to within +/?0.05 millimeters throughout the length of the extruded waveguide, resulting in transported millimeter-waves. And producing, on a reflector, an illumination pattern that is accurate to a degree that allows conforming to a first level of radiation pattern accuracy, by applying the transported millimeter-waves at a focal point of the reflector.
    Type: Grant
    Filed: August 31, 2010
    Date of Patent: March 18, 2014
    Assignee: Siklu Communication Ltd.
    Inventors: Yigal Leiba, Ovadia Haluba
  • Publication number: 20140057570
    Abstract: Various embodiments of a millimeter-wave wireless point-to-point or point-to-multipoint communication system which maintains a stable communication link even in the face of problems such as vibration or other mechanical disturbance to transceivers in the system or radio interference to the transmission beam produced by a transmitter and received by a receiver. The system comprises a transmitter, a receiver, a high-gain antenna, and allied equipment as described. In various embodiments, a beam is mechanically or electronically redirected to improve system performance. In various embodiments, the modulation schemes or coding schemes of the transmission are altered to improve system performance.
    Type: Application
    Filed: August 23, 2012
    Publication date: February 27, 2014
    Applicant: Siklu Communication Ltd.
    Inventor: Yigal Leiba