Abstract: An electronic film cartridge includes a can section that defines an outer contour and is used to hold electronic components, and an imager assembly. The outer contour is configured so as to not completely depress at least one sensor mounted to the film compartment of a photographic camera into which the film cartridge is to be inserted. The electronic film cartridge is also configured to fit within different cameras with different dimensions between the film can area and the aperture.

Abstract: An electronic film (E-film) apparatus that reversibly converts a conventional film camera body into an E-film camera is described. The electronic film apparatus includes one or more state sensors that sense the operating state of the camera body. State sensors include an electromagnetic sensor, an acoustic sensor, and/or an optical sensor. The data gathered by the sensors is used to determine the operating state of the camera. Based on the operating state of the camera, the E-film apparatus operates in various power modes, including sleep modes, low power modes, and full power modes. The electromagnetic sensor includes a loop or coil that converts electromagnetic fields into an electrical signal. The acoustic sensor senses vibrations in the camera due to operation of the mechanical aspects of the camera body. The acoustic sensor converts vibrations in the camera body into an electrical signal.

Abstract: An integrated circuit package that provides a reference plane relative to an image plane of an image sensor is described. The reference plane is aligned with respect to the image plane of the sensor such that the sensor can be mounted in an optical assembly quickly, easily, accurately, and inexpensively. The package can be thin, allowing for use of the package in retrofit applications such as using the packaged image sensor in a conventional 35 mm camera. The package includes a standoff frame for mounting a transparent window. The package includes reference members, such as rails, that define the reference plane. The package provides a desired tolerance between the reference plane and image plane of the sensor when the sensor is bonded into the package. The window can be flat or configured as a lens to focus the image on the image plane. The window can be configured such that its front (outer) face becomes the image plane of the packaged image sensor.