Abstract: A circuit and method for driving electrostatic microelectomechanical systems (MEMS) are provided. In one embodiment, the circuit includes a first electrode in a movable element of the MEMS and a second electrode on a surface of a substrate of the MEMS over which the movable element is suspended, and a driver electrically coupled to the first and the second electrodes. The driver supplies a voltage differential between the first and second electrodes to vary an electrostatic force between the electrodes thereby moving the movable element. The driver is configured to supply a voltage pulse having a leading edge in which a first voltage intermediate between an initial, minimum voltage and a maximum voltage is maintained for a first time before rising to the maximum voltage timed to dampen oscillations of the movable element. Other embodiments are also described.

Abstract: A spatial light modulator (SLM) module and methods of designing, manufacturing and using the same are provided. In one embodiment, the SLM module comprises a diffractive, diffractive SLM formed on a substrate, the SLM including a plurality of pixels each including a plurality of electrostatically deflectable actuators, and a driver including a number of drive channels each coupled to one of the plurality of electrostatically deflectable actuators. Each of the drive channels include at least one internal digital-to-analog converter (DAC) integrally formed on the same substrate as the SLM. In one embodiment, the DAC is a multi-slope charge integrating DAC. In other embodiments, the driver includes circuitry to test each of the drive channels, and a spare drive channel that can be switched in to replace a defective drive channel.

Abstract: Megasonic cleaning systems and methods of fabricating and using the same are provided. In one embodiment, the system comprises a plurality of Micro-Electromechanical System (MEMS) transducers, each transducer including a movable membrane with a membrane electrode coupled to a first potential disposed above and spaced apart from an upper surface of a die including a cavity electrode coupled to a second potential, the membrane including multiple layers including a polysilicon layer between a top silicon nitride layer and a bottom silicon nitride layer, and the membrane electrode includes the polysilicon layer; a chuck on which a target workpiece is positioned; and a fluid to couple sonic energy from the plurality of MEMS transducers to the target workpiece. Other embodiments are also provided.

Abstract: A flow through Micro-Electromechanical Systems (MEMS) package and methods of operating a MEMS packaged using the same are provided. Generally, the package includes a cavity in which the MEMS is enclosed, an inlet through which a fluid is introduced to the cavity during operation of the MEMS and an outlet through which the fluid is removed during operation of the MEMS, wherein the package includes features that promote laminar flow of the fluid across the MEMS. The package and method are particularly useful in packaging spatial light modulators including a reflective surface and adapted to reflect and modulate a light beam incident thereon. Other embodiments are also provided.

Abstract: A system including spatial light modulators with multiple one-dimensional (1D) diffractor arrays and methods of operating the same are provided. In one embodiment, the system comprises a spatial light modulator (SLM) assembly including a plurality of one-dimensional (1D) diffractor arrays to modulate light from a light source, the plurality of 1D diffractor arrays integrally formed on a die; illumination optics disposed in a light path between the plurality of 1D diffractor arrays and the light source to illuminate a substantially linear portion of at least one of the plurality of 1D diffractor arrays; and imaging optics disposed in a light path between the SLM assembly and an image plane on a target-substrate, the imaging optics adapted to transmit modulated light from the SLM assembly to a substantially linear portion of the image plane. Other embodiments are also provided.

Abstract: A flow through Micro-Electromechanical Systems (MEMS) package and methods of operating a MEMS packaged using the same are provided. Generally, the package includes a cavity in which the MEMS is enclosed, an inlet through which a fluid is introduced to the cavity during operation of the MEMS and an outlet through which the fluid is removed during operation of the MEMS. In certain embodiments, the fluid includes an gas, such as nitrogen, and the inlet and outlet are adapted to provide a flow of gas of from 0.01 Standard Cubic Centimeters per Minute (sccm) to 10000 sccm during operation of the MEMS. The package and method are particularly useful in packaging spatial light modulators including a reflective surface and adapted to reflect and modulate a light beam incident thereon. Other embodiments are also provided.

Abstract: A diffractive MicroElectroMechanical systems and a method of fabricating the same are provided. In one embodiment, the method comprises: depositing a sacrificial layer onto a substrate; depositing a first structural layer on the sacrificial layer and patterning the structural layer to form a patterned structural layer including plurality of actuators; conformably depositing a sacrificial film on the patterned structural layer; depositing a second structural layer on the sacrificial film; planarizing the second structural layer to expose the sacrificial film and the plurality of actuators; and removing the sacrificial layer and sacrificial film to release the plurality of actuators, each of the plurality of actuators separated from the second structural layer by a thickness of the conformal sacrificial film. Other embodiments are also provided.

Abstract: A film recorder including a linear diffractive spatial light modulator (LDSLM) and methods of using the same to record a digital image on a strip of photographic film are provided. In one embodiment, the recorder includes: an illuminator including at least one monochromatic light source generating a light beam; a spatial light modulator assembly including at least one linear diffractive spatial light modulator (LDSLM) to receive the light beam from the illuminator and modulate the light beam from the illuminator; a film transport for transporting a photographic film on an imaging plane; and imaging optics disposed in a light path between the LDSLM and the imaging plane to image the light beam simultaneously on a substantially linear portion of the photographic film to record an image on the photographic film. Other embodiments are also provided.

Abstract: A spatial light modulator (SLM) module and methods of designing, manufacturing and using the same are provided. In one embodiment, the SLM module comprises a diffractive, diffractive SLM formed on a substrate, the SLM including a plurality of pixels each including a plurality of electrostatically deflectable actuators, and a driver including a number of drive channels each coupled to one of the plurality of electrostatically deflectable actuators. Each of the drive channels include at least one internal digital-to-analog converter (DAC) integrally formed on the same substrate as the SLM. In one embodiment, the DAC is a multi-slope charge integrating DAC. In other embodiments, the driver includes circuitry to test each of the drive channels, and a spare drive channel that can be switched in to replace a defective drive channel.

Abstract: A method of fabricating an integrated device including a MicroElectroMechanical system (MEMS) and an associated microcircuit is provided. In one embodiment, the method comprises: forming a high temperature contact through a dielectric layer to an underlying element of a microcircuit formed adjacent to a MicroElectroMechanical System (MEMS) structure on a substrate; and depositing a layer of conducting material over the dielectric layer, and patterning the layer of conducting material to form a local interconnect (LI) for the microcircuit overlying and electrically coupled to the contact and a bottom electrode for the adjacent MEMS structure. Other embodiments are also provided.

Abstract: A method of fabricating an integrated device including a MicroElectroMechanical system (MEMS) and an associated microcircuit is provided. In one embodiment, the method comprises: forming a high temperature contact through a dielectric layer to an underlying element of a microcircuit formed adjacent to a MicroElectroMechanical System (MEMS) structure on a substrate; and depositing a layer of conducting material over the dielectric layer, and patterning the layer of conducting material to form a local interconnect (LI) for the microcircuit overlying and electrically coupled to the contact and a bottom electrode for the adjacent MEMS structure. Other embodiments are also provided.

Abstract: A method of fabricating an integrated device including a MicroElectroMechanical system (MEMS) and an associated microcircuit is provided. In one embodiment, the method comprises: forming a high temperature capable contact through a dielectric layer to an underlying element of a microcircuit formed adjacent to a MicroElectroMechanical System (MEMS) structure on a substrate; and depositing a layer of conducting material over the dielectric layer, and patterning the layer of conducting material to form a local interconnect (LI) for the microcircuit overlying and electrically coupled to the contact and a bottom electrode for the adjacent MEMS structure. Other embodiments are also provided.

Abstract: A film recorder including a linear diffractive spatial light modulator (LDSLM) and methods of using the same to record a digital image on a strip of photographic film are provided. In one embodiment, the recorder includes: an illuminator including at least one monochromatic light source generating a light beam; a spatial light modulator assembly including at least one linear diffractive spatial light modulator (LDSLM) to receive the light beam from the illuminator and modulate the light beam from the illuminator; a film transport for transporting a photographic film on an imaging plane; and imaging optics disposed in a light path between the LDSLM and the imaging plane to image the light beam simultaneously on a substantially linear portion of the photographic film to record an image on the photographic film. Other embodiments are also provided.

Abstract: A linear dense-packed spatial light modulator (LDSLM) and method of modulating light using the same are provided. In one embodiment, the LDSLM comprises a plurality of two dimensional (2D) modulators grouped proximal to one another on a surface of a substrate to form a densely-packed, linear array having a plurality of pixels along a longitudinal axis of the array. Each pixel includes a number of 2D modulators electrically coupled to receive a common drive signal and to modulate light reflected therefrom in response to the drive signal. Preferably, each pixel includes at least two 2D modulators grouped along a transverse axis of the array. More preferably, the number of 2D modulators along the transverse axis in each pixel is selected to provide a desired power density while avoiding an undesired thermal gradient across the LDSLM. The LDSLM and method are particularly useful in printing applications. Other embodiments are also disclosed.

Abstract: A holographic data storage (HDS) system and method are provided. Generally, the system includes: a light source for generating a coherent light; beam-forming optics for forming the light into collimated object and reference beams; holographic storage medium; a spatial light modulator (SLM) located in a path of the object beam from the beam-forming optics to the storage medium, the SLM having a number of pixels for encoding data to be stored in the medium into the object beam. Preferably, the SLM can modulate both the amplitude and phase of light from every pixel on the SLM. More preferably, the SLM is also located in a path of the reference beam to the storage medium to modulate the phase of the light to store multiple holographic pages of data in the same physical volume of medium through phase multiplexing. Other embodiments are also described.

Abstract: One embodiment relates to a hybrid micro electromechanical systems (MEMS) based spatial light modulator (SLM) capable of operating in both analog and digital modes. The hybrid SLM includes a substrate having an upper surface, a number of movable ribbons disposed a predetermined distance above the upper surface of the substrate, the ribbons having light reflective surfaces formed on their upper side facing away from the upper surface of the substrate, and a number of standoffs having a predetermined height positioned between a lower surface of the movable ribbons and the upper surface of the substrate. The standoffs are configured to limit the ribbon deflection of movable ribbons toward the upper surface of the substrate when the SLM is operated in digital mode with snap-down voltages applied between the ribbon and drive electronics in the substrate. Other embodiments are also disclosed.

Abstract: An architecture and method are provided for preventing snapdown in a voltage controlled MEMS device having a movable actuator with an actuator electrode coupled to a high voltage power supply (HVPS) through a drive circuit, the movable actuator suspended over a cavity electrode formed on a substrate and coupled to a common backplane supply (VssC). Generally, the circuit includes a number of first diodes coupled between the HVPS and the actuator electrode and/or the cavity electrode to provide a forward-biased path to transfer a positive charge to the HVPS when the accumulated charge exceeds a predetermined threshold. Preferably, the drive circuit further includes second diodes to provide a low impedance path to transfer a positives charge from the actuator electrode and/or the cavity electrode to a substrate ground when the accumulated charge results in or exceeds a predetermined threshold voltage. Other embodiments are also disclosed.

Abstract: A circuit and method are provided for preventing snapdown in a voltage controlled Micro-Electromechanical System device having a movable actuator with an actuator electrode coupled to a first potential, the actuator suspended over a cavity electrode coupled to a second potential. Generally, the circuit includes an in-circuit conductive path between the actuator electrode and the cavity electrode, the conductive path configured to transfer charge therebetween when a voltage between the first and second potential exceeds a predetermined threshold voltage. In one embodiment the conductive path comprises an ESD clamp coupled between the actuator electrode and the cavity electrode. Other embodiments are also disclosed.

Abstract: In one embodiment, a ferroelectric material is processed by placing the material in an environment including metal vapor and heating the material to a temperature below the Curie temperature of the material. This allows the bulk conductivity of the ferroelectric material to be increased without substantially degrading its ferroelectric domain properties. In one embodiment, the ferroelectric material comprises lithium tantalate and the metal vapor comprises zinc.

Abstract: One embodiment relates to a method of independently controlling amplitude and phase modulation by a spatial light modulator. Light is illuminated onto upper layer deflectable planar areas and lower layer deflectable planar areas over a substrate of the spatial light modulator. First active circuitry on the substrate is used to provide amplitude modulation by controlling a relative displacement between upper layer deflectable planar areas and adjacent lower layer deflectable planar areas. Second active circuitry on the substrate is used to provide phase modulation by controlling a displacement between the (upper and lower layer) deflectable planar areas and the substrate. Other embodiments and features are also disclosed.