Patents Assigned to Silicon Micro Sensors GmbH
  • Patent number: 8803059
    Abstract: A sensor and a corresponding method for the determination of the incidence angle of a radiation source are provided. The sensor has a diode assembly of avalanche photodiodes in a semiconductor layer and an application specific integrated circuit, a distance layer, an aperture structure located on the distance layer, and contacts for electrically connecting the sensor. The layers and structures are positioned directly on top of each other and match in their shape, size or thickness.
    Type: Grant
    Filed: December 22, 2011
    Date of Patent: August 12, 2014
    Assignee: Silicon Micro Sensors GmbH
    Inventors: Erik Busse, Wilhelm Prinz von Hessen
  • Patent number: 8522620
    Abstract: A pressure sensor in contact with an aggressive fluid for a pressure measurement has a board with a pressure passage. The pressure passage is closed on one side by a sensor chip as a pressure sensing element. The board also mounts an integrated circuit and electrical contacts for electrical contacting of the pressure sensor. At least the on board arranged pressure sensing element as well as the integrated circuit are tightly enclosed by a capper made of a fluid resistant material in connection with the board, and are arranged in an encasing cavity formed by the capper and the board for fluid resistant protection.
    Type: Grant
    Filed: October 15, 2010
    Date of Patent: September 3, 2013
    Assignee: Silicon Micro Sensors GmbH
    Inventors: Jens Koehler, Lars Petersen, Sebastian Hagedorn
  • Patent number: 8488045
    Abstract: A stereoscopic camera for recording the surroundings is provided with a right and a left image sensor having one lens each to display the surroundings on the image sensors, with the image sensors and the lenses being held by a carrier side-by-side and at a distance in reference to each other. The stereoscopic camera is additionally provided with a circuit board arranged on the carrier and comprising at least the signal and the supply lines of both image sensors. The image sensors are each mounted on a carrier substrate, which similar to the lenses, are arranged on the carrier and are distanced in reference to the circuit board, and have a flexible electric connection to the circuit board.
    Type: Grant
    Filed: November 26, 2008
    Date of Patent: July 16, 2013
    Assignee: Silicon Micro Sensors GmbH
    Inventor: Erik Busse
  • Patent number: 8433445
    Abstract: A method and device to control electrical devices using motion detection are presented, through which an object inside a monitoring area which is subdivided into a pre-detection area and a detection area is successively identified as well as verified in the detection area for reducing power input in standby mode and during operation in the main cycle using distance measurements and its position consequently determined. During the course of the distance measurements, the control device is brought into a readiness state and later on into operating state. After finishing the distance measurements and determining the position of the object in the detection area, an output signal which serves to control an external electrical device is generated by a control device.
    Type: Grant
    Filed: October 25, 2010
    Date of Patent: April 30, 2013
    Assignee: Silicon Micro Sensors GmbH
    Inventors: Erik Busse, Wilhelm Prinz Von Hessen
  • Patent number: 8159604
    Abstract: An image acquisition device of a camera that has an electronic sensor chip, electrically connected to a circuit board, includes an objective situated in an objective carrier, and oriented in regard to situation and inclination in relation to an imager surface of the sensor chip. The situation and inclination of the objective are defined by a contact surface of the objective carrier. The contact surface of the objective carrier lies flat on the sensor chip, so that the imager surface is not covered by the contact surface.
    Type: Grant
    Filed: February 20, 2009
    Date of Patent: April 17, 2012
    Assignee: Silicon Micro Sensors GmbH
    Inventor: Erik Busse
  • Patent number: 7954384
    Abstract: A pressure sensor comprises a housing, a housing plug and a pressure port, which projects into the housing. The pressure sensor has a pressure-sensing element adhesively cemented on the pressure port, so that a passage, located in the pressure port, is sealed. To produce an adhesive film between the pressure port and the housing, the pressure port or the housing or both exhibit a recess in a region, which borders at least section by section on the adhesive film. The volume of recess is equal to the volume of the adhesive film. To produce the adhesive film, the intermediate space between the pressure port and the housing is filled with the adhesive, which was introduced into the recess, while utilizing a capillary effect.
    Type: Grant
    Filed: September 3, 2009
    Date of Patent: June 7, 2011
    Assignee: Silicon Micro Sensors GmbH
    Inventors: Jens Koehler, Wilhelm Prinz Von Hessen
  • Patent number: 7600433
    Abstract: A pressure sensor comprises a housing, a housing socket and a pressure port which projects into the housing and which is made of a lead free material. The pressure sensor exhibits a pressure sensing element, which is adhesively cemented on the pressure port, so that a passage, located in the pressure port, is sealed on one side. In one region, the pressure port exhibits a surface roughness and is provided with an adhesion promoting coat. In this region, the pressure sensing element is connected by adhesive cement to the pressure port.
    Type: Grant
    Filed: February 18, 2008
    Date of Patent: October 13, 2009
    Assignee: Silicon Micro Sensors GmbH
    Inventors: Jens Koehler, Lars Petersen
  • Publication number: 20080202250
    Abstract: A pressure sensor comprises a housing, a housing socket and a pressure port which projects into the housing and which is made of a lead free material. The pressure sensor exhibits a pressure sensing element, which is adhesively cemented on the pressure port, so that a passage, located in the pressure port, is sealed on one side. In one region, the pressure port exhibits a surface roughness and is provided with an adhesive bonding coat. Therefore, in this region the pressure sensing element is connected by adhesive cement to the pressure port.
    Type: Application
    Filed: February 18, 2008
    Publication date: August 28, 2008
    Applicant: Silicon Micro Sensors GmbH
    Inventors: Jens Koehler, Lars Petersen