Abstract: A reconstructed package for an integrated circuit (IC) chip and a method of re-configuring any prefabricated IC package (with or without a silicon chip and wires inside) so that an IC chip can be installed and interconnected for normal use. A pre-molded plastic or other package is abraded to expose the wire bond pads and to form a mounting surface to which a new chip may be mounted. The encapsulating material is removed without damaging the plating material on the lead frame. The new chip is then mounted onto the mounting surface and new wire bonds are connected between the new chip and the lead frame. Encapsulating material, such as epoxy, is then placed over the chip and wire bonds and cured. The invention provides an alternative process whereby the die can be encapsulated in minutes per unit.