Patents Assigned to Silicon Pipe
  • Stair step printed circuit board structures for high speed signal transmissions
    Patent number: 7280372
    Abstract: Disclosed are stair stepped PCB structures which provide high performance, direct path, via-less interconnections between various elements of an electronic interconnection structure including, among others, IC packages and connectors.
    Type: Grant
    Filed: November 15, 2004
    Date of Patent: October 9, 2007
    Assignee: Silicon Pipe
    Inventors: Kevin P. Grundy, William F. Wiedemann, Joseph C. Fjelstad
  • Insulating substrate for IC packages having integral ESD protection
    Patent number: 7205613
    Abstract: An IC package substrate having integral ESD protection features and elements and a method for construction of the same are disclosed
    Type: Grant
    Filed: January 7, 2005
    Date of Patent: April 17, 2007
    Assignee: Silicon Pipe
    Inventors: Joseph C. Fjelstad, Kevin P. Grundy