Abstract: A mixture of hydroxylamine partially neutralized with a weak carboxylic acid and an organic solvent such as an alkyl sulfoxide, a pyrrolidinone or a sulfone removes hardened photoresist and polymeric photoresist residues from a substrate with reduced metal corrosion.
Abstract: A composition and method for removing probing ink and negative photoresist from a substrate with reduced metal corrosion, low toxicity and rapid removal rates. The composition includes a mixture of anisole, an alkylarylsulfonic acid, and aliphatic hydrocarbons containing 9 to 13 carbon atoms.
Abstract: High purity oximes are prepared from aqueous hydroxylamine and ketones reacted at ambient temperature without addition of impurities such as salts or acids.
Abstract: Amidoximes are prepared from aqueous hydroxylamine and nitrites to yield amidoximes. Reaction of acetonitrile with aqueous hydroxylamine at ambient temperature yields acetamidoxime crystals.
Abstract: A mixture of a dibasic ester (DBE), an alcohol, and water to remove photoresist from a silicon wafer substrate. Photoresist is effectively removed at ambient temperature with this non-phenolic, non-halogenated stripper solution. Dissolved photoresist is easily separated from the water mixture for disposal.
Abstract: A mixture of a dibasic ester (DBE), an alcohol, and water to remove photoresist from a silicon wafer substrate. Photoresist is effectively removed at ambient temperature with this non-phenolic, non-halogenated stripper solution. Dissolved photoresist is easily separated from the water mixture for disposal.