Patents Assigned to Siliconfile Technologies Imc.
  • METHOD OF MANUFACTURING INTEGRATED CIRCUIT HAVING STACKED STRUCTURE AND THE INTEGRATED CIRCUIT
    Publication number: 20100081233
    Abstract: Provided are a method of manufacturing an integrated circuit having a stacked structure by forming a crystalline semiconductor thin film on a crystalline or amorphous substrate and the integrated circuit. Accordingly, the method of manufacturing the integrated circuit having the stacked structure uses a method of growing a crystalline semiconductor thin film on a polycrystalline or amorphous substrate, so that the method can be easily performed at low costs, and high-speed processing and high-density integration can be achieved.
    Type: Application
    Filed: December 7, 2007
    Publication date: April 1, 2010
    Applicant: Siliconfile Technologies Imc.
    Inventor: Byoung Su Lee