Patents Assigned to Siliconware Prescision Industries Co., Ltd.
  • Electronic package and fabrication method thereof
    Patent number: 10236227
    Abstract: An electronic package is provided, including a circuit portion, an electronic element disposed on the circuit portion and a lid member disposed on the circuit portion to cover the electronic element. A separation portion is formed between the lid member and the electronic element. The lid member facilitates to prevent warping of the overall package structure. The invention further provides a method for fabricating the electronic package.
    Type: Grant
    Filed: December 24, 2015
    Date of Patent: March 19, 2019
    Assignee: Siliconware Prescision Industries Co., Ltd.
    Inventors: Lung-Shan Chuang, Ching-Wen Chiang, Tzung-Yen Wu, Chun-Hung Lu