Abstract: A process for machining a wafer-like workpiece between two plates, in which material is abraded from the workpiece under the influence of an auxiliary substance supplied and of a pressure acting on the workpiece. In this process, the pressure on the workpiece is significantly reduced and then increased again at least once during the machining of the workpiece, and the supply of the auxiliary substance is reduced as the pressure is increased.
Type:
Grant
Filed:
June 27, 2003
Date of Patent:
November 2, 2004
Assignee:
Siltronic AG Corporate Intellectual Property