Abstract: A heat dissipating apparatus applied in a tower computer includes a housing, and the housing includes a motherboard, a storage device and a fixing frame. Electronic components and interface cards are installed on the motherboard and storage devices are installed on the motherboard. The fixing frame has a fan at a position opposite to the motherboard and the storage device, so that the airflow direction of the fan is parallel to the interface cards. The housing further includes an external port on a corresponding surface away from the standing position of the housing, and a hood covered onto the corresponding opposite surface, such that the fan blows air in a single direction directly at the heat generating components. The outside cold air is sucked directly into the crevice at the bottom of the housing by a positive wind pressure difference to reduce dusts from entering the house through other crevices.

Abstract: The present invention discloses a selective independent overload and group overload protection circuit of a power supply. In the power supply, each of a plurality of loads that require a larger power output has an independent overload protection circuit, and the load is connected to a group overload protection circuit, such that a user can select to turn on the independent overload protection circuit or a group overload protection circuit that allows a larger power output and facilitates the user to select an appropriate power output according to the capacity requirement of the load.

Abstract: The present invention discloses a connecting modular structure for DC output of power supply. The power supply installed in electronic equipment has a housing and the housing has a mainboard installed that is connected to the external input power, and the mainboard has more than one DC output conducting contact points, and the other end of the conducting contact point is respectively connected with the DC power output connector via electric wires, and the power connector is fixed onto the lateral board of the housing so that when in use, the electric wires would not be exposed since the power connector is fastened onto the lateral board of the housing, whereby other devices of the electronic equipment can be connected to the power connector on the lateral board and get the needed power. Thus, the lateral board looks tidy and neat and is convenient for use.

Abstract: A liquid-cooling heat dissipating device for dissipating heat by a casing includes a casing having a liquid flow channel and a heat dissipating fin, both integrally formed on a wall of the casing. The casing includes a panel having a cold connector and a hot connector. The cold connector is connected to a water tank and the hot connector is connected to the liquid flow channel. Another end of the connectors are connected to a water-cooling connector through a pipeline, and the water-cooling connector is installed at a heat source, such that the pipeline sends heated liquid to the liquid flow channel on the wall of the casing, and the heat dissipating fin on the casing dissipates the heat to the outside, and the cooled liquid is returned to the water tank and sent to the water-cooling connector on the heat source by the pipeline for repeated cycles.

Abstract: A heat dissipating apparatus of a computer system is used for a first heat generating component (such as an interface card and a display card) of the computer system without being interfered by a second heat generating component (such as a hard disk drive and an optical disk drive) of the heat dissipating apparatus. The heat dissipating apparatus has a rack installed between the first and second heat generating components, corresponding openings on both sides of the rack, a fan between the openings, and holes disposed on the casing and corresponding to the openings of the rack. The fan is rotated to drive external cold air into the casing through the openings of the rack from the holes of the casing and blown at the first heat generating component directly to improve the heat dissipating effect without being interfered by the second heat generating component in the casing.

Abstract: A liquid-cooling heat dissipating device for dissipating heat by a casing includes a casing having a liquid flow channel and a heat dissipating fin, both integrally formed on a wall of the casing. The casing includes a panel having a cold connector and a hot connector. The cold connector is connected to a water tank and the hot connector is connected to the liquid flow channel. Another end of the connectors are connected to a water-cooling connector through a pipeline, and the water-cooling connector is installed at a heat source, such that the pipeline sends heated liquid to the liquid flow channel on the wall of the casing, and the heat dissipating fin on the casing dissipates the heat to the outside, and the cooled liquid is returned to the water tank and sent to the water-cooling connector on the heat source by the pipeline for repeated cycles.