Patents Assigned to Simm Tech Co. Ltd.
  • Multiple layer module structure for printed circuit board
    Patent number: 6265672
    Abstract: A printed circuit board having multiple layers, includes: a copper film for removing signal interference and noise and matching impedance, formed between pads of a lowermost layer which are connected to of an uppermost layer.
    Type: Grant
    Filed: March 22, 1999
    Date of Patent: July 24, 2001
    Assignee: Simm Tech Co. Ltd.
    Inventors: Jae Suk Eum, Young Han Kim