Abstract: A method of accelerating heat dissipation for a compact electronic device has steps of defining a heat dissipation opening as an airflow emission opening on a compact electronic device; defining connection port and slot as intake openings on the compact electronic; and extracting air from the airflow emission opening to make cold air effectively enter the intake openings. Therefore, the cold air thoroughly passes multiple heating elements and then to go out via the airflow emission opening. In this way, to force convection is achieved, so as to enhance cooling efficiency.