Patents Assigned to Simple Technology Incorporated
  • Patent number: 5562504
    Abstract: A communications card provides an electronic interface between a host computer and a transmission media line. The communications card includes a releasable adaptor which interconnects an electrical connector of the transmission media line to the communications card when in use. The adaptor also integrates into the overall configuration of the communication card in a storage position to present a configuration that conforms with PCMCIA communication card architecture. The adaptor releasably attaches to the communication card when in the storage position. The releasable connection between the communication card and the adaptor allows replacement of the adaptor when worn or damages, without replacing the entire communications card. And the integral storage position of the adaptor allows a user to internally carry the adaptor with the communications card within the host computer.
    Type: Grant
    Filed: January 4, 1995
    Date of Patent: October 8, 1996
    Assignee: Simple Technology Incorporated
    Inventor: Mark Moshayedi
  • Patent number: 5514907
    Abstract: A multi-chip memory module comprises multiple standard, surface-mount-type memory chips stacked on top of each other, and a pair of printed circuit boards mounted on opposite sides of the memory chips to electrically interconnect the memory chips. Each printed circuit board has vias that are positioned to form multiple rows, with each row of vias used to connect the printed circuit board to a respective memory chip. The vias falling along the bottom-most row of each printed circuit board are also exposed and are used to surface mount the multi-chip module to pads of a memory board.
    Type: Grant
    Filed: March 21, 1995
    Date of Patent: May 7, 1996
    Assignee: Simple Technology Incorporated
    Inventor: Mark Moshayedi
  • Patent number: RE36916
    Abstract: A multi-chip memory module comprises multiple standard, surface-mount-type memory chips stacked on top of each other, and a pair of printed circuit boards mounted on opposite sides of the memory chips to electrically interconnect the memory chips. Each printed circuit board has vias that are positioned to form multiple rows, with each row of vias used to connect the printed circuit board to a respective memory chip. The vias falling along the bottom-most row of each printed circuit board are also exposed and are used to surface mount the multi-chip module to pads of a memory board.
    Type: Grant
    Filed: April 22, 1998
    Date of Patent: October 17, 2000
    Assignee: Simple Technology Incorporated
    Inventor: Mark Moshayedi