Abstract: When mounting pinless electronic components on the conductor path side of a printed circuit card, the components are oriented in a predetermined manner, depending on the desired orientation at the mounting site, in component trays from which the components are transferred to the printed circuit card by means of a manually operated suction device. On the conductor path side of the printed circuit card, an adhesive material has previously been applied to the intended mounting sites of the components, the suction force of the suction device being set at a lower value than the adhesive force of the adhesive material.