Patents Assigned to Singapore Asahi Chemical and Solder Industries Pte Ltd
  • Publication number: 20070125834
    Abstract: A substantially lead-free solder, comprising: from around 96.8% to around 99.3% tin; from around 0.2 % to around 3.0% copper; and from around 0.02% to around 0.12% silicon.
    Type: Application
    Filed: February 12, 2007
    Publication date: June 7, 2007
    Applicants: Quantum Chemical Technologies (Singapore) Pte. Ltd., Singapore Asahi Chemical & Solder Industries Pte. Ltd.
    Inventors: Kai CHEW, Vincent KHO
  • Patent number: 6843862
    Abstract: A substantially lead-free solder with enhanced properties comprises from 88.5% to 93.5% tin; from 3.5% to 4.5% silver; from 2.0% to 6.0% indium; and from 0.3% to 1.0% copper. The solder may also comprise up to 0.5% of an anti-oxidant or anti-skinning additive. A solder embodying the invention finds particular utility in wave-soldering processes where it may be used as a direct replacement for conventional tin/lead solder.
    Type: Grant
    Filed: August 17, 2001
    Date of Patent: January 18, 2005
    Assignees: Quantum Chemical Technologies (Singapore) Pte Ltd, Singapore Asahi Chemical and Solder Industries Pte Ltd
    Inventors: Kai Hwa Chew, Wei Chih Pan
  • Patent number: 5785098
    Abstract: A syringe or cartridge has a displaceable stopper located herein, and an apparatus for filling the syringe or cartridge has a reservoir for holding a flowable filling material and a plunger associated with the reservoir to exert pressure on the flowable material in the reservoir. The plunger includes at least one dispensing port defining a channel through the plunger for connection with the syringe or cartridge to be filled. The apparatus also has a pressurizer for applying pressure to the plunger.
    Type: Grant
    Filed: November 5, 1996
    Date of Patent: July 28, 1998
    Assignee: Singapore Asahi Chemical & Solder Industries Pte. Ltd.
    Inventors: Vincent Kho Yue Sern, See Soon Lee, Chew Kai Hwa