Patents Assigned to SINOVIA
  • Patent number: 11276845
    Abstract: A method of depositing a cathode on an organic light emitting diode (OLED) stack is provided. The method includes providing a substrate having at least a partial organic light emitting diode (OLED) stack disposed on a surface of the substrate. The method further includes depositing, on top of the partial OLED stack, a solution comprising a metal compound. The method further includes forming a conductive solid layer from the metal compound in the solution to form a cathode for the partial OLED stack.
    Type: Grant
    Filed: August 19, 2020
    Date of Patent: March 15, 2022
    Assignee: SINOVIA TECHNOLOGIES
    Inventors: Whitney Gaynor, Bang-Yan Liu
  • Patent number: 10782804
    Abstract: A method of fabricating a composite conductive film is provided. The method includes providing, as a matrix, a layer of cross-linkable polymer while the cross-linkable polymer is in a substantially noncross-linked state. The method further includes introducing a plurality of inorganic nanowires onto a surface of the layer of cross-linkable polymer and embedding at least some of the plurality of inorganic nanowires into the layer of cross-linkable polymer to form an inorganic mesh within the layer of cross-linkable polymer, thereby forming the composite conductive film. The method further includes cross-linking the cross-linkable polymer within at least a surface portion of the composite conductive film, wherein following the cross-linking, the cross-linkable polymer within at least the surface portion of the composite conductive film is in a cross-linked state.
    Type: Grant
    Filed: February 4, 2019
    Date of Patent: September 22, 2020
    Assignee: Sinovia Technologies
    Inventors: Whitney Gaynor, George Burkhard
  • Patent number: 10234969
    Abstract: A method of fabricating a composite conductive film is provided. The method includes providing, as a matrix, a layer of cross-linkable polymer, where the cross-linkable polymer is in a non-cross-linked state. The method further includes introducing inorganic nanowires upon a surface of the layer of cross-linkable polymer. The inorganic nanowires are, in isolated form, characterized by a first conductivity stability temperature. The method further includes embedding at least some of the inorganic nanowires into the layer of cross-linkable polymer to form an inorganic mesh, thereby forming the composite conductive film. The method further includes cross-linking the polymer within a surface portion of the composite conductive film. Cross-linking the polymer within the surface portion of the composite conductive film results in the surface portion having a second conductivity stability temperature that is greater than the first conductivity stability temperature.
    Type: Grant
    Filed: April 24, 2017
    Date of Patent: March 19, 2019
    Assignee: Sinovia Technologies
    Inventors: Whitney Gaynor, George Burkhard
  • Patent number: 9666337
    Abstract: A composite conductive film is provided that includes a layer of cross-linked polymer having a surface and an inorganic mesh comprising a plurality of nanowires of an inorganic material. The nanowires are, in isolated form, characterized by a first conductivity stability temperature. Further, the plurality of nanowires is embedded within at least a region of the layer of cross-linked polymer, where the region is continuous from the surface of the layer of cross-linked polymer. The layer of cross-linked polymer and the inorganic mesh are arranged to form the composite conductive film having a second conductivity stability temperature that is greater than the first conductivity stability temperature.
    Type: Grant
    Filed: September 15, 2014
    Date of Patent: May 30, 2017
    Assignee: Sinovia Technologies
    Inventors: Whitney Gaynor, George Burkhard
  • Patent number: 9491853
    Abstract: A composite conductive film is provided that includes a layer of cross-linked polymer having a surface and an inorganic mesh comprising a plurality of inorganic nanowires. The plurality of inorganic nanowires is embedded throughout at least a region of the layer of cross-linked polymer. The region is continuous from the surface of the layer of cross-linked polymer. The layer of cross-linked polymer and the inorganic mesh are arranged to form the composite conductive film. The composite conductive film has a pencil test hardness in a range of 2H to 9H.
    Type: Grant
    Filed: September 15, 2014
    Date of Patent: November 8, 2016
    Assignee: Sinovia Technologies
    Inventors: Whitney Gaynor, George Burkhard
  • Publication number: 20140267107
    Abstract: A composite conductive film is provided that includes a layer of photoresist material and an inorganic mesh comprising a plurality of particles of an inorganic material. The plurality of particles of the inorganic mesh is embedded within the layer of photoresist material and the layer of photoresist material and the inorganic mesh are arranged to form the composite conductive film. Furthermore, a method of making a composite conductive film is provided that includes providing, as a matrix, a layer of photoresist material, introducing a plurality of inorganic particles upon a surface of the layer of photoresist material and embedding at least some of the plurality of inorganic particles into the layer of photoresist material to form an inorganic mesh within the layer of photoresist material, thereby forming the composite conductive film.
    Type: Application
    Filed: March 11, 2014
    Publication date: September 18, 2014
    Applicant: Sinovia Technologies
    Inventors: Whitney Gaynor, George Burkhard
  • Publication number: 20090219151
    Abstract: An ergonomic and extensible supervision system, in particular for technical management of buildings, centralized technical management and fire safety, using data of at least one computerized plan representing the installation to be supervised and the technical elements of the installation and including: an automatic computer-based reading component for analyzing and extracting data from the plan in the form of blocks containing at least one technical element; a computer-based viewing component for generating, from the data supplied by the reading component, and data concerning the technical elements, a list of variables and data corresponding to the blocks, including the mapping data of the technical elements; a computer-based matching component for matching the list of variables with the technical elements located in the installation to be monitored, so as to constitute a supervising application; means for parametering the supervising application, using a man/machine interface.
    Type: Application
    Filed: July 26, 2005
    Publication date: September 3, 2009
    Applicant: SINOVIA
    Inventors: Carlos Moreno, Yu Liu, Stephane Belot
  • Publication number: 20090106378
    Abstract: An open system for integrating and managing computer-based components representing a specific functionality of a specific application with a computer-based core including: a standard context for integrating computer-based components into the specific application; an integrating protocol including instantiating and loading means for indexing, selecting and assigning computer-based components to the execution of functional objectives of the specific application; connecting means for setting up connections and monitoring message flows among the computer-based components; at least one man-machine interface for enabling the connections and the message flows among the computer-based components to be monitored by a user; specific computer-based components, dedicated to the execution of specific applications.
    Type: Application
    Filed: July 26, 2005
    Publication date: April 23, 2009
    Applicant: SINOVIA
    Inventors: Carlos Moreno, Yu Liu, Stephane Belot