Abstract: The present invention relates to a method and apparatus for drying a continuous material impregnated with a hardenable synthetic resin. The material is moved through at least one treating chamber within which radiant heat is applied onto the material and into which air is introduced in order to dilute the gaseous substances generated during the drying process and to at least partially exhaust them. The method is characterized in that heat is applied onto the continuous material in the form of radiant heat, and in that air is conducted in a controlled manner into the treating chamber as preheated fresh air and is guided to form a laminar air current that is substantially parallel to the continuous material as is possible. The installation has in the treating chamber (10, 11) at least one radiant heater (34, 36) and at least one fresh air inlet device (26) which is connected with a controlled fresh air supply device (40) and a heating device (38).

Abstract: Clamp-like guides are arranged in the interior of a soldering bath container at a distance from each other and distributed across the width of the soldering bath container. Each guide has two guide rods which are spaced from each other by a certain distance and which are connected with each other at their lower ends. The upper final sections of the guide rods project upward from a soldering bath and have deflections at their upper ends which form a narrowing therebetween. The final sections can be elastically deflectable and are supported by support springs. Above the guides, two blast nozzles extend across the width of the soldering bath container and direct hot air jets against the surfaces of printed circuit boards leaving the soldering bath. The width of the narrowing is somewhat larger than the thickness of the printed circuit boards.

Abstract: A printed circuit board solder leveling device comprising guides distributed across the width of the soldering bath container. Each guide comprises opposed guide rods spaced apart a distance greater than the thickness of a printed circuit board so that there is loose contact only of the guides with opposite sides of the board.

Abstract: Printed circuit boards which are to be tin-plated pass through a liquid application station in a horizontal direction, and thereafter through an activation station for the activation of the applied liquid. Then the printed circuit boards arrive at a receiver element of substantially U-shaped cross-sectional configuration, which subsequently is pivoted about a horizontal pivot shaft, out of a horizontal take-up position into a vertical transfer position. During this pivotal movement the printed circuit board bears upon a support element or part which supports the printed circuit board. By means of grippers the printed circuit board, previously brought by the receiver element into a vertical position, is immersed in vertical position into a solder bath. After a certain residence time the printed circuit board is inserted by the gripper into a further receiver element likewise having a U-shaped cross-sectional configuration, this receiver element being located in a vertical receiving position.

Abstract: A material web impregnated with a settable synthetic resin travels in vertical direction, from the bottom towards the top, through a first heat treatment zone where the solvent of the synthetic resin or plastic is evaporated and there occurs a chemical reaction. The tacky material web departing from the first heat or thermal treatment zone then passes through a cooling zone where it is cooled by means of a cooling medium to such a degree that it does not stick to the deflection or diverting rolls over which the material web subsequently is guided. After deflection of the material web the latter is moved in vertical direction downwardly through a second heat treatment zone where the chemical reaction proceeds. Prior to winding-up of the material web the latter is further cooled.