Abstract: The present invention provides a uniform flow control agitation device for electroplating, which involves the rotation of one or two flow-uniformization plates within an electroplating tank. This design effectively eliminates fluctuations in the electroplating solution during the electroplating process, thereby preventing bubbles from forming on the surface of the wafer. Simultaneously, the rotation of the flow-uniformization plates promotes the movement of ions in the electroplating solution, resulting in greater uniformity in the electrodeposit coating on the wafer's surface.