Patents Assigned to SiTime Corpoaration
  • Stacked-die MEMS resonator system
    Patent number: 9821998
    Abstract: In a microelectromechanical system (MEMS) device, a CMOS die is affixed to a die-mounting surface and wire-bonded to electrically conductive leads, and a MEMS die is stacked on and electrically coupled to the CMOS die in a flip-chip configuration. A package enclosure envelopes the MEMS die, CMOS die and wire bonds, and exposes respective regions of the electrically conductive leads.
    Type: Grant
    Filed: June 20, 2016
    Date of Patent: November 21, 2017
    Assignee: SiTime Corpoaration
    Inventors: Pavan Gupta, Aaron Partridge, Markus Lutz