Patents Assigned to SiWave, Inc., a Delaware corporation
  • High density fiber terminator/connector
    Publication number: 20030202769
    Abstract: A high density fiber terminator/connector and methods of making the high density fiber terminator/connector are provided. One method comprises using deep reactive ion etching to etch a plurality of holes in a silicon substrate and placing a fiber in at least one hole.
    Type: Application
    Filed: May 29, 2003
    Publication date: October 30, 2003
    Applicant: SiWave, Inc., a Delaware corporation
    Inventors: Roman Carlos Gutierrez, Tony Kai Tang