Patents Assigned to SIYANG GRANDE ELECTRONICS CO., LTD.
  • Patent number: 11024567
    Abstract: A surface mount (SMD) diode taking a runner as the body and a manufacturing method thereof are described. An elongated runner groove is adopted to cure and package groups of diode chips arranged side by side and corresponding copper pins thereon, with the utilization rate of epoxy resin up to 90% or more. The use cost of epoxy resin is thus reduced, and environmental pollution is also reduced.
    Type: Grant
    Filed: November 7, 2019
    Date of Patent: June 1, 2021
    Assignee: SIYANG GRANDE ELECTRONICS CO., LTD.
    Inventor: Yunhui Zhong