Abstract: A method for protecting at least one wafer from contamination, the method including the steps of heating the wafer in an apparatus for semiconductor processing having a reaction core (102), providing a first voltage level to a wafer transfer device (108), and providing a second voltage level lower than the first voltage level, near the reaction core (102), thereby activating the protection.

Abstract: A wafer transfer device or boat and semiconductor cleaning apparatus including a wafer transfer device and a heatable reaction core is provided. The wafer transfer device has a first unit with a plurality of first slots for receiving a first group of semiconductor wafers and a second unit with a plurality of slots for receiving a second group of semiconductor wafers. The first slots alternate with the second slots. The first unit is connectable to a first voltage source and the second unit is connectable to a second voltage source. The second voltage source is more electronegative than the first one. Typically, the first group of semiconductor wafers have impurities therein which are to be removed and the second group of semiconductor wafers are to receive the impurities.