Patents Assigned to SK-Electronics Co., Ltd.
  • Patent number: 12569614
    Abstract: [Problem] The purpose of the present invention is to provide a portable anticancer agent container for preventing exposure and infection to the human body caused by chemical solution leakage that arises during a removal operation of a coupling connector at the time of system cleaning using a cleaning solution.
    Type: Grant
    Filed: April 20, 2020
    Date of Patent: March 10, 2026
    Assignee: SK-Electronics CO., LTD.
    Inventors: Akihito Tsuji, Naoki Matsuda
  • Patent number: 12236306
    Abstract: A contactless information medium is provided with a spiral wiring on an IC chip. The IC chip has first and second electrodes, and the spiral wiring has first and second end portions electrically connected to the first and second electrodes, respectively. A first relay wiring is connected to the first electrode via a first connecting hole. The first end portion is connected to the first relay wiring via a third connecting hole formed on an inner peripheral side of the spiral wiring. The first relay wiring includes a rectangular region diagonally including the first connecting hole and the third connecting hole.
    Type: Grant
    Filed: April 7, 2020
    Date of Patent: February 25, 2025
    Assignee: SK-ELECTRONICS CO., LTD.
    Inventors: Kiyoshi Ohshima, Hideki Kobayashi
  • Patent number: 11258173
    Abstract: Provided is an LC resonant antenna including: an inductor layer provided with a coil-shaped inductor; and a capacitor layer laminated on the inductor layer in a direction of an axis along a coil center of the inductor. The capacitor layer includes a capacitor connected to the inductor. The capacitor includes a pair of electrode plates arranged in parallel at a distance from each other in a laminating direction.
    Type: Grant
    Filed: November 2, 2018
    Date of Patent: February 22, 2022
    Assignees: SK-Electronics Co., Ltd., KYOCERA CORPORATION
    Inventors: Hideki Kobayashi, Kiyoshi Ohshima, Koji Yamashita, Takeshi Hasegawa
  • Patent number: 11258160
    Abstract: Provide is an LC resonant antenna including: an inductor layer provided with a coil-shaped inductor; and a capacitor layer provided with a capacitor and laminated on the inductor layer. The capacitor includes a plurality of electrode plates that are aligned with the inductor in a laminating direction of the inductor layer and the capacitor layer and that extend in a surface direction orthogonal to the laminating direction. The inductor is formed to have an axis of a coil center extending in a direction that coincides or substantially coincides with the laminating direction. The plurality of electrode plates each have a passage area that corresponds in the laminating direction to an internal area surrounded by the inductor and allows magnetic flux to pass therethrough.
    Type: Grant
    Filed: November 2, 2018
    Date of Patent: February 22, 2022
    Assignee: SK-Electronics Co., Ltd.
    Inventors: Hideki Kobayashi, Kiyoshi Ohshima
  • Patent number: 10528859
    Abstract: The present invention aims to provide an RFID tag capable of improving antenna efficiency with a simple configuration. Such an RFID tag includes: an antenna configured with a reader/writer; an IC chip to which the antenna is connected; a plurality of connection terminals inside outer peripheral edges of an insulating layer on which the antenna is formed; and an annular antenna-forming area on the entire periphery or substantially the entire periphery of the insulating layer. The antenna is formed into a loop in the antenna-forming area, with one of the plurality of connection terminals serving as a starting point and with one of the remaining connection terminals serving as an endpoint.
    Type: Grant
    Filed: April 12, 2017
    Date of Patent: January 7, 2020
    Assignee: SK-Electronics Co., Ltd.
    Inventor: Hideki Kobayashi
  • Patent number: 9806408
    Abstract: An antenna of the present invention includes a laminate body including a conductor core, an insulator layer, and a conductor pattern. The conductor pattern is a conductor layer formed of a conducting body disposed on a radially outer side of the insulator layer. The conductor core and the conductor pattern are connected to each other in such a manner that a current is made to flow in a direction from the conductor core to the conductor pattern or in a direction opposite thereto so as to coincide with a power supply direction.
    Type: Grant
    Filed: October 8, 2013
    Date of Patent: October 31, 2017
    Assignee: SK-Electronics Co., Ltd.
    Inventors: Shiro Sugimura, Kazuo Ogata, Shoji Hashimoto
  • Patent number: D873823
    Type: Grant
    Filed: March 27, 2018
    Date of Patent: January 28, 2020
    Assignee: SK-Electronics Co., Ltd.
    Inventor: Tadashi Kurita