Abstract: The present invention relates to a copper foil current collector having superior adhesion to an active material of a Li secondary battery. The electrolytic copper foil of the present invention having a first surface and a second surface comprises: a first protective layer at the first surface; a second protective layer at the second surface; and a copper film between the first and second protective layers, wherein an oxygen-containing part at the second surface has a thickness (OT) of not less than 1.5 nm. According to the present invention, an electrolytic copper foil current collector for a Li secondary battery, which has low electric resistance and high adhesion to an active material, can be provided.

Abstract: The present invention relates to an electrolytic copper foil having excellent handling characteristics in the manufacture of copper foil and in post-processing for manufacturing a secondary battery. The present invention provides an electrolytic copper foil having a first surface and a second surface, wherein the texture coefficient of the (220) plane of the electrolytic copper foil is 0.4-1.32, the difference (|?(Rz/Ra)|) between Rz/Ra on the first surface and Rz/Ra on the second surface, of the electrolytic copper foil, is less than 2.42, and the difference (|?PD|) in peak density (PD) between the first surface and the second surface, of the electrolytic copper foil, is 96 ea or less.

Abstract: An embodiment of the present invention provides a copper foil which comprises a copper layer and an anticorrosive film placed on the copper layer, and has a Young's modulus of 3800 to 4600 kgf/mm2 and a modulus bias factor (MBF) less than 0.12, wherein the modulus bias factor (MBF) is obtained by formula 1 below.

Abstract: Disclosed is a copper foil including a copper layer having a matte surface and a shiny surface, and an anticorrosive layer disposed on the copper layer, wherein the copper foil has a residual stress of 0.5 to 25 Mpa, based on absolute value, and the copper layer has a plurality of crystal planes, wherein a ratio [TCR (220)] of a texture coefficient (TC) of (220) crystal plane of the copper layer to a total of texture coefficients (TC) of (111), (200), (220) and (311) crystal planes of the copper layer is 5 to 30%.

Abstract: Disclosed are an electrolytic copper foil the fold and/or wrinkle of which can be avoided or minimized during a roll-to-roll process, a method for manufacturing the same, and an electrode and a secondary battery which are produced with such electrolytic copper foil so that high productivity can be guaranteed. An electrolytic copper foil of the disclosure has a longitudinal rising of 30 mm or less and a transverse rising of 25 mm or less, and the transverse rising is 8.5 times the longitudinal rising or less.

Abstract: Disclosed is a copper foil including a copper layer and an anticorrosive layer disposed on the copper layer, wherein the copper foil has a peak to arithmetic mean roughness (PAR) of 0.8 to 12.5, a tensile strength of 29 to 58 kgf/mm2, and a weight deviation of 3% or less, wherein the PAR is calculated in accordance with the following Equation 1: PAR=Rp/Ra??[Equation 1] wherein Rp is a maximum profile peak height and Ra is an arithmetic mean roughness.

Abstract: The present invention relates to an electrolytic copper foil current collector where the surface properties are controlled to achieve a high adhesiveness to a negative electrode material. An electrolytic copper foil has a first surface and the second surface, the electrolytic copper foil comprising a first protective layer on the first surface side, a second protective layer on the second surface side, and a copper film between the first and second protective layers, wherein the coupling coefficient at the first surface or second surface of the electrolytic copper foil is 1.5 to 9.4 as represented by coupling coefficient=Rp/?m+ peak density/30+ amount of Cr adhesion/(mg/m2) (here, peak density is measured according to ASME standard B46.1). The electrolytic copper foil has a high adhesiveness to a negative electrode material and a low electrical resistance can be provided by controlling the surface properties of the electrolytic copper foil surface.