Abstract: A board, including a first pad area, a second pad area, a first micro heater, a second micro heater, a first heater terminal pad, a second heater terminal pad, and a third heater terminal pad, is provided. The first pad area and the second pad area respectively include at least one pad. The first micro heater and the second micro heater are respectively disposed corresponding to the first pad area and the second pad area. The first heater terminal pad and the second heater terminal pad form a loop with the first micro heater by being electrically connected to an outside, so that the first micro heater generates heat. The second heater terminal pad and the third heater terminal pad form another loop with the second micro heater by being electrically connected to the outside, so that the second micro heater generates heat. A circuit board and a fixture are also provided.

Abstract: A method for cutting substrate includes the steps of forming a cutting path on a substrate, applying a laser beam onto the substrate to form a plurality of holes with a pitch less than or equal to 20 micro meters along the cutting path, increasing the temperature of an area of the substrate containing the plurality of holes, and if necessary, applying force to separate the substrate along the plurality of holes. An equipment for cutting substrate includes a carrying platform, a laser generating device, a heating device, and a control module. The carrying platform is used for carrying a substrate. The laser generating device can generate a laser beam. The control module can control the laser beam generated by the laser generating device to move on the substrate along a track, and then guide the heating device to heat the substrate along the track.

Abstract: A board, including a first pad area, a second pad area, a first micro heater, a second micro heater, a first heater terminal pad, a second heater terminal pad, and a third heater terminal pad, is provided. The first pad area and the second pad area respectively include at least one pad. The first micro heater and the second micro heater are respectively disposed corresponding to the first pad area and the second pad area. The first heater terminal pad and the second heater terminal pad form a loop with the first micro heater by being electrically connected to an outside, so that the first micro heater generates heat. The second heater terminal pad and the third heater terminal pad form another loop with the second micro heater by being electrically connected to the outside, so that the second micro heater generates heat. A circuit board and a fixture are also provided.

Abstract: A board, including a pad layer, a micro heater layer, and an insulating layer which are laminated, is provided. The pad layer includes a pad. The micro heater layer includes a micro heater. The micro heater is disposed corresponding to the pad. The insulating layer is located between the pad layer and the micro heater layer. A resistance value of the micro heater ranges from 10 ? to 500 ?. A circuit board is also provided.

Abstract: A method for forming a film pattern includes: providing a substrate having a surface on which the film pattern is to be formed; providing a pattern material containing a hot-melt glue; providing a mask, wherein the mask includes a light-transmitting portion and a light-non-transmitting portion, wherein the pattern material is between the substrate and the mask; irradiating the mask by using a light source capable of generating heat, wherein the light generated by the light source passes through the light-transmitting portion, so that the pattern material under the light-transmitting portion is attached to the surface of the substrate by the melting of the hot-melt glue; and removing the mask and the pattern material under the light-non-transmitting portion.

Abstract: A light conversion composite material assembly includes at least one light conversion material and a carrier. The at least one light conversion material is distributed inside the carrier. The carrier is formed by a mixture. The mixture includes at least one inorganic material and at least one organic material. The at least one inorganic material includes a mica. A method of manufacturing the light conversion composite material assembly includes placing the light conversion material, the inorganic material including the mica and the organic material into a solvent to form a mixture solution; heating the mixture solution up to a first temperature, so that the organic material is dissolved in the mixture solution and the inorganic material is suspended in the mixture solution; and cooling the mixture solution down to a second temperature, so that the light conversion composite material assembly is separated out from the mixture solution.

Abstract: A film coating method includes the following steps of: providing an object to be coated; providing a mask; disposing the mask above the object; disposing a coating material film above the object and the mask; and making the coating material film and the object approach each other so as to make the coating material film form a coating layer on a surface area to be coated of the object through a pattern of the mask. A light-emitting device includes a substrate and a plurality of light-emitting parts separately arranged on an upper surface of the substrate. An optical wavelength conversion layer covers a light-emitting surface of the light-emitting part. The optical wavelength conversion layer is a compact powder layer and touches the upper surface. The upper surface has a clearance area without the compact powder layers thereon between adjacent two of the light-emitting parts.

Abstract: A micro heater chip, a wafer-level electronic chip assembly and a chip assembly stacking system are provided. The chip assembly stacking system includes a plurality of wafer-level electronic chip assemblies stacked on top of one another and electrically connected with each other. Each wafer-level electronic chip assembly includes a wafer-level electronic chip and a micro heater chip disposed on the wafer-level electronic chip. The micro heater chip includes a heating structure and an insulative structure disposed between the heating structure and the wafer-level electronic chip. The heating structure includes a carrier body, at least one micro heater disposed on or inside the carrier body, and a plurality of conductive connection layers passing through the carrier body. The insulative structure includes an insulative body disposed between the heating structure and the wafer-level electronic chip, and a plurality of conductive material layers passing through the insulative body.

Abstract: An optical wavelength conversion composite material is provided and includes a first wavelength conversion material and an inorganic covering layer. The first wavelength conversion material is selected from the group consisting of a first quantum dot, a first phosphor, and a combination thereof. The inorganic covering layer covers the first wavelength conversion material, and the inorganic covering layer includes SiO2, TiO2 and SixTiyO4?z, wherein x is from 0.1 to 0.4, y is from 0.5 to 0.8, and z is from 0.01 to 3.99. The optical wavelength conversion composite material has improved luminous efficiency and is stable. Besides, a related manufacturing method and a related optical wavelength conversion composite structure are provided.

Abstract: A chip-transferring system and a chip-transferring method are provided. The chip-transferring method includes: providing a chip carrying structure carrying an electronic chip; providing a circuit substrate, wherein a soldering material is configured between the electronic chip and the circuit substrate; providing a pin structure, wherein the electronic chip is transferred from the chip carrying structure to the circuit substrate through thrust of the pin structure; approaching a conductive coil structure of an eddy current generating module toward the soldering material , so that the soldering material is heated and cured indirectly through an eddy current generated by the conductive coil structure.

Abstract: A film structure, a chip carrier assembly, and a chip carrier device are provided. The film structure includes a film and a plurality of micro-heaters. In which, the film is applied on a substrate, and the plurality of micro-heaters is disposed on top of the film or in the film. The chip carrier assembly includes a circuit substrate and the film structure. In which, the circuit substrate carries a plurality of chips. The chip carrier device includes the chip carrier assembly and a suction unit. In which, the suction unit is arranged above the chip carrier assembly to attach on and transfer the plurality of chips to the circuit substrate. The chips are disposed on the circuit substrate through solder balls, and the micro-heaters heat the solder balls that are in contact with the chips.

Abstract: A chip mounting structure and a chip mounting device are provided. The chip mounting structure includes a circuit substrate and a plurality of micro heaters. The circuit substrate has a plurality of solder pads. A plurality of micro heaters are disposed on the circuit substrate adjacent to the solder pad. The plurality of chips are disposed on the circuit substrate, and the chip is electrically connected to the solder pad by a solder ball. Therefore, the soldering yield of the process can be reduced by the chip mounting structure and the chip mounting device.