Abstract: A vertical FET, including a source layer, a channel layer, a drain layer and a gate dielectric, the source layer being coupled with a source electrode, the channel layer being deposited on top of the source layer, the drain layer being deposited on top of the channel layer and being coupled with a drain electrode, the gate dielectric being conformally deposited within a cylindrical niche through the drain layer down to the channel layer, the gate dielectric being encircled by the drain layer, the gate dielectric being coupled with a gate electrode deposited within the cylindrical niche, when a threshold voltage Is applied to the gate electrode a channel is formed between the source layer and the drain layer, a length of the channel corresponding to a thickness of the channel layer and a width of the channel corresponding to a perimeter of the cylindrical niche.

Abstract: A method for growing islands of semiconductor monocrystals from a solution on an amorphous substrate includes the procedures of depositing a semiconductor-metal mixture layer, applying lithography and etching for forming at least one platform, heating the at least one platform, and saturating the semiconductor-metal solution until a monocrystal of the semiconductor component is formed. The procedure of depositing a semiconductor-metal mixture layer, includes a semiconductor component and at least one other metal component, is performed on top of the amorphous substrate. The procedure of applying lithography and etching to the semiconductor-metal mixture layer and a portion of the amorphous substrate is performed for forming at least one platform, the at least one platform having a top view shape corresponding to crystal growth direction and habit respective of the semiconductor component.

Abstract: A method for growing islands of semiconductor monocrystals from a solution on an amorphous substrate includes the procedures of depositing a semiconductor-metal mixture layer, applying lithography and etching for forming at least one platform, heating the at least one platform, and saturating the semiconductor-metal solution until a monocrystal of the semiconductor component is formed. The procedure of depositing a semiconductor-metal mixture layer, includes a semiconductor component and at least one other metal component, is performed on top of the amorphous substrate. The procedure of applying lithography and etching to the semiconductor-metal mixture layer and a portion of the amorphous substrate is performed for forming at least one platform, the at least one platform having a top view shape corresponding to crystal growth direction and habit respective of the semiconductor component.